A method for producing an ohmic contact on a crystallographic C-side of a silicon carbide substrate. The method includes: applying a layer stack to the crystallographic C-side of the silicon carbide substrate, the layer stack including at least one semiconducting layer containing germanium, and at least one metallic layer; and producing a point-by-point liquid phase of the layer stack, a surface of the layer stack being scanned using laser beams.

A semiconductor device, including a substrate, a deposition layer deposited on the substrate, a semiconductor region selectively provided in the deposition layer, a semiconductor layer provided on the deposition layer and the semiconductor region, a first region and a second region selectively provided in the semiconductor layer, a gate electrode provided on the second region and the semiconductor layer via a gate insulating film, a source electrode in contact with the semiconductor layer and the second region, an interlayer insulating film covering the gate electrode, a drain electrode provided on the substrate, a plating film selectively provided on the source electrode at portions thereof on which the protective film is not provided, and a pin-shaped electrode connected to the plating film via solder. The second region is not formed directly beneath a portion where the plating film, the protective film and the source electrode are in contact with one another.

A field effect gas sensor, for detecting a presence of a gaseous substance in a gas mixture, the field effect gas sensor comprising: a SiC semiconductor structure; an electron insulating layer covering a first portion of the SiC semiconductor structure; a first contact structure at least partly separated from the SiC semiconductor structure by the electron insulating layer; and a second contact structure conductively connected to a second portion of the SiC semiconductor structure, wherein at least one of the electron insulating layer and the first contact structure is configured to interact with the gaseous substance to change an electrical property of the SiC semiconductor structure; and wherein the second contact structure comprises: an ohmic contact layer in direct contact with the second portion of the SiC semiconductor structure; and a barrier layer formed by an electrically conducting mid-transition-metal oxide covering the ohmic contact layer.

A method for forming an electrical contact is provided. The method includes grinding a silicon carbide surface using a grinding disk which includes a grinding face containing nickel or a nickel compound, such that particles of the nickel or nickel compound from the grinding disk are embedded in the ground silicon carbide surface, and hardening the ground silicon carbide surface with the aid of a laser, such that at least some of the embedded nickel particles form a nickel silicide with silicon from the silicon carbide.

The present disclosure relates to methods of manufacturing Ohmic contacts on a silicon carbide (SiC) substrate including providing a 4H—SiC or 6H—SiC substrate, implanting dopants into a surface region of the 4H—SiC or 6H—SiC substrate, annealing the implanted surface regions to form a 3C—SiC layer, and depositing a metal layer on the 3C—SiC layer. An implanting sequence of the implantation of dopants includes a plurality of plasma deposition acts with implantation energy levels including at least two different implantation energy levels. The implantation energy levels and one or more implantation doses of the plurality of plasma deposition acts are selected to form a 3C—SiC layer in the surface region of the 4H—SiC or 6H—SiC substrate during the annealing act. A method of manufacturing a semiconductor device having a structure including at least three layers including a 4H—SiC or 6H—SiC layer, a 3C—SiC layer, and a metal layer, by applying one or more of the techniques described herein, and semiconductor devices obtained with one or more of the techniques described herein are described.

In a silicon carbide semiconductor device in which a contact electrode is formed on a single-crystal silicon carbide semiconductor substrate, a barrier metal (titanium nitride layer) covers an interlayer insulating film in a region other than a contact hole, and a contact electrode of a predetermined electrode material is formed only in a region on the silicon carbide semiconductor substrate in the contact hole opened in the interlayer insulating film on the silicon carbide semiconductor substrate. A top of the barrier metal is covered by a metal electrode (wiring layer) and no nickel metal aggregates are present between the barrier metal and the metal electrode.

A method of manufacturing a metal silicide layer comprises performing laser thermal annealing of a surface region of a silicon carbide (SiC) substrate, exposing a surface of a thus obtained silicon layer, depositing a metal layer above the exposed silicon layer, and/or thermally treating a stack of layers, comprising the silicon layer and the metal layer, to form a metal silicide layer. Alternatively and/or additionally, the method may comprise depositing a silicon layer above a SiC substrate, depositing a metal layer, and/or performing laser thermal annealing of the SiC substrate and a stack of layers above the SiC substrate to form a metal silicide layer, wherein the stack of layers comprises the silicon layer and the metal layer. Moreover, a semiconductor device is described, comprising a SiC substrate, a metal silicide layer, and a polycrystalline layer in direct contact with the SiC substrate and the metal silicide layer.

A metal layer is deposited on a wafer that has silicon carbide, wherein the metal layer forms a contact face. A laser annealing is performed at the contact face using a laser beam application that causes the metal layer to react with the wafer and form a silicide layer. The laser beam has a footprint having a size. To laser anneal the contact face, a first portion of the contact face is irradiated, the footprint of the laser beam is moved by a step smaller than the size of the footprint, and a second portion of the contact face is irradiated, thereby causing the first portion and the second portion of the contact face to overlap.

Provided is a manufacturing method of a semiconductor device including a semiconductor substrate, including: forming an interlayer dielectric film above the semiconductor substrate; forming contact holes exposed from a part of an upper surface of the semiconductor substrate on the interlayer dielectric film; and forming an metal electrode including an element of aluminum by DC sputtering above the interlayer dielectric film and inside the contact holes, wherein in at least a part of a process of forming the metal electrode in forming the electrode, a heating temperature that is a temperature for heating the semiconductor substrate is 400° C. or higher, and a DC sputtering power is 5 kW or lower.

A silicon carbide semiconductor device, including a semiconductor substrate, and a first semiconductor region, a plurality of second semiconductor regions, a plurality of third semiconductor regions and a plurality of fourth semiconductor regions formed in the semiconductor substrate. The semiconductor device further includes a plurality of trenches penetrating the second, third and fourth semiconductor regions, a plurality of gate electrodes respectively provided via a plurality of gate insulating films in the trenches, a plurality of fifth semiconductor regions each provided between one of the gate insulating films at the inner wall of one of the trenches, and the third semiconductor region and the fourth semiconductor region through which the one trench penetrates. The semiconductor device further includes first electrodes electrically connected to the second, third and fourth semiconductor regions, and a second electrode provided on a second main surface of the semiconductor substrate.