A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.

A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.

A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.

A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a first circuit board having an opening extending through the first circuit board. A Chemical Vapor Deposition Diamond (CVDD) window extends within the opening. A layer of thermally conductive paste extends over the CVDD window. A semiconductor die extends over the layer of thermally conductive paste such that a hot-spot on the semiconductor die overlies the CVDD window.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a first circuit board having an opening extending through the first circuit board. A Chemical Vapor Deposition Diamond (CVDD) window extends within the opening. A layer of thermally conductive paste extends over the CVDD window. A semiconductor die extends over the layer of thermally conductive paste such that a hot-spot on the semiconductor die overlies the CVDD window.

A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.

A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a first circuit board having an opening extending through the first circuit board. A Chemical Vapor Deposition Diamond (CVDD) window extends within the opening. A layer of thermally conductive paste extends over the CVDD window. A semiconductor die extends over the layer of thermally conductive paste such that a hot-spot on the semiconductor die overlies the CVDD window.