A multi-channel filter with a PCB with a first side with signalling tracks and shielding tracks between neighbouring signalling tracks. On the second side, a conductive layer is provided. The signalling tracks are covered by an electromagnetically absorbing material, such as a powder of an electrically conducting material is provided. The filter may have sections with reversed structure where the conductors are on the second side and the layer on the first side, where the conductors on opposite sides are interconnected. The filter may be rolled or folded.

A filter device includes an input terminal, an output terminal, a main body, a common electrode provided to the main body, a ground terminal, and LC parallel resonators connected to the common electrode and the ground terminal. Each LC parallel resonator includes a capacitor, a first via, and a second via. One end of the first via is connected to the common electrode, and another end thereof is connected to the ground terminal through the capacitor. One end of the second via is connected to the common electrode, and another end thereof is connected to the ground terminal without through the capacitor. The second via is connected between portions of the common electrode to which the first vias of two adjacent resonators are connected.

A superconducting circuit may include a transmission line having at least one transmission line inductance, a superconducting resonator, and a coupling capacitance that communicatively couples the superconducting resonator to the transmission line. The transmission line inductance may have a value selected to at least partially compensate for a variation in a characteristic impedance of the transmission line, the variation caused at least in part by the coupling capacitance. The coupling capacitance may be distributed along the length of the transmission line. A superconducting circuit may include a transmission line having at least one transmission line capacitance, a superconducting resonator, and a coupling inductance that communicatively couples the superconducting resonator to the transmission line. The transmission line capacitance may be selected to at least partially compensate for a variation in coupling strength between the superconducting resonator and the transmission line.

Tires including a tire bodies formed of one or more tire plies are disclosed. In some implementations, tire plies may include a temperature sensor that may detect a temperature of a respective tire ply. The temperature sensor may include a ceramic material organized as a matrix and one or more split-ring resonators (SRRs). Each of the SRRs may have a natural resonance frequency configured to shift in response to one or more of a change in an elastomeric property or a change in the temperature of a respective one or more tire plies. The temperature sensor may include an electrically-conductive layer dielectrically separated from a respective one or more SRRs. A thickness each of the SRRs may be approximately between 0.1 micrometers (μm) and 100 μm.

Tires formed of one or more tire plies are disclosed. In some implementations, tire plies may include a temperature sensor that may detect a temperature of a respective tire ply. The temperature sensor may include one or more split-ring resonators (SRRs), each having a resonance frequency that changes in response to one or more of a change in an elastomeric property or a change in the temperature of a respective one or more tire plies. In some aspects, the temperature sensor may include an electrically-conductive layer dielectrically separated from a respective one or more SRRs.

A package antenna apparatus including a package substrate, wherein an antenna array is disposed on the package substrate, and a transceiver chip coupled to the antenna array, where the transceiver chip is fastened to the package substrate, and the transceiver chip has a first pad and a second pad, and a filter disposed on the package substrate, where the filter comprises an input port and an output port, the input port is coupled to the first pad of the transceiver chip, the output port is coupled to the second pad of the transceiver chip, and the filter is configured to filter a signal of the transceiver chip that is input through the input port, and is further configured to output a filtered signal to the transceiver chip through the output port.

Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

The present disclosure relates to coupled slow-wave transmission lines. In this regard, a transmission line structure is provided. The transmission line structure includes a first undulating signal path formed from first loop structures. The transmission line structure also includes a second undulating signal path formed from second loop structures. The second undulating signal path is disposed alongside of the first undulating signal path. Further, a first ground structure is disposed above or below either one or both of the first undulating signal path and the second undulating signal path.

A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

The present disclosure relates to a tunable slow-wave transmission line. The tunable slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. The tunable slow-wave transmission line includes a first ground structure disposed along the undulating signal path. Further, the tunable slow-wave transmission line includes one or more circuits that may alter a signal transmitted in the tunable slow-wave transmission line so as to tune a frequency of the signal.