Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.

The present disclosure relates to a printed circuit board assembly, which includes: a first printed circuit board, printed with a first transmission trace; a second printed circuit board, printed with a second transmission trace; a substrate, in which, the provides a through aperture for a radio frequency connector; and a radio frequency connector, which includes an inner contact portion, an housing and an insulating part provided between the inner contact portion and housing, where the radio frequency connector is configured to be received in and pass through the through aperture, such that a first end of the inner contact portion of the radio frequency connector is electrically connected to the first transmission trace and a second end thereof is electrically connected to the second transmission trace, so that a first end of the housing of the radio frequency connector is electrically connected to a ground layer of the first printed circuit board and a second end thereof is electrically connected to the ground layer of the second printed circuit board. Thus, the printed circuit board assembly is capable of improving aspects such as shielding effects, PIN performance and/or degree of integration compared with prior art.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

An electrical connector is provided. The electrical connector is to be attached to a cloth in which a conductive pattern is formed. The electrical connector includes an insulating housing having a boss portion provided on a surface of the housing, where the surface is to be in contact with the cloth, and the boss portion is inserted into the cloth; a connection terminal provided to the housing; and a conductive pad provided around the boss portion on the surface of the housing, where the surface is to be in contact with the cloth, and the conductive pad is electrically connected to the connection terminal. The conductive pad has a protrusion protruding in the same direction as the boss portion of the housing protrudes.

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The stack has at least one central stack section, at least one cavity stack section, and at least one vertical opening formed in the cavity stack section. The cavity stack section at least partially surrounds the central stack section, and the thickness of the central stack section is greater than the thickness of the cavity stack section.

A voltage regulator module includes a circuit board, a positive input terminal, a negative input terminal, a positive output terminal, a negative output terminal, a switching circuit, a magnetic element and an input capacitor. The switching circuit is disposed on a top surface of the circuit board, and comprises two switches connected in series to form a midpoint, wherein the switching circuit is connected to the positive input terminal. The magnetic element comprises a magnetic core and a conductive structure in the circuit board, wherein the magnetic element and the switching circuit are arranged on the circuit board along a first direction, the conductive structure is connected to the midpoint of the corresponding switching circuit and the positive output terminal. The input capacitor is connected to the positive input terminal and the negative input terminal, and disposed on a bottom surface of the circuit board.

An electronic unit includes a first board and a second board which are stacked on each other, a first connector mounted on a surface of the first board which faces the second board, and a second connector mounted on a surface of the second board which faces the first board. Each of the first connector and the second connector has a fitting portion and a lock portion configured to lock a fitting of the fitting portion. The fitting portion and the lock portion of the first connector are provided between the first board and the second board in a stack direction in which the first board and the second board are stacked. The fitting portion and the lock portion of the second connector are provided between the first board and the second board in the stack direction.

A printed circuit board module comprises: a first printed circuit board; a second printed circuit board arranged on one surface of the first printed circuit board; a third printed circuit board arranged on the other surface of the first printed circuit board; and a core passing through the first printed circuit board to the third printed circuit board, wherein the second printed circuit board includes a first coil, the third printed circuit board includes a second coil, and the cross-sectional area of the second printed circuit board and the third printed circuit board is less than the cross-sectional area of the first printed circuit board.

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

An electrical connecting structure and a method for manufacturing the same are disclosed. The electrical connecting structure comprises: a first substrate; a second substrate; and an interconnect element disposed between the first substrate and the second substrate, wherein the interconnect element has a width, and no joint surface is present in the interconnect element in a range of 50% or more of the width.