According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a liquid crystal layer and a light source that emits light to the liquid crystal layer, and the first substrate includes a first portion opposing the second substrate and having a first thickness and a second portion not opposing the second substrate and having a second thickness which is less than the first thickness, and the light source is disposed on the second portion, and the light source includes a first surface opposing the second portion and a second surface opposing the first surface, and a wiring substrate is disposed on the second surface so that the wiring substrate does not protrude with respect to the second substrate in a thickness direction.

Disclosed is an optical package assembly. The optical package assembly includes a substrate (100), a light sensor chip (200), and a protection portion. The protection portion and the light sensor chip (200) both are fixed to the substrate (100), the light sensor chip (200) is packaged in the protection portion, a plane on which the light sensor chip (200) is located intersects with a plane of the substrate (100), and the protection portion includes a light entering region. Further disclosed is a mobile terminal.

A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via.

A substrate is manufactured by drilling a chip containing groove in a composite inner layer circuit structure, having a component connecting end of a circuit layer protruding from a mounting side wall in the chip containing groove, mounting a chip component in the chip containing groove, and connecting the surface bonding pad to the component connecting end. The chip component in the present invention penetrates at least two circuit layers, and the surface bonding pad is bonded to the component connecting end of the circuit layer directly, reducing the occupied area of the chip component in each one of the circuit layers, and increasing the area for circuit disposing and the possible amount of chip components that may be mounted in the substrate.

A connection system for a printed circuit board employs either an inline or transverse board-mounted connector for holding board-mounted optical fibers. A plug-in connector can blind mate with the board-mounted connector. The plug-in connector has a plug-in connector body, a plug-in ferrule, and a plug-in ferrule holder. The plug-in holder latches with the plug-in connector body at either of two positions to selectively configure the plug-in connector for blind mating with either the inline or transverse board-mounted connector. The board-mounted fibers can be supported by a board-mounted ferrule assembly including a ferrule and a ferrule holder that is configured to selectively attach the board-mounted ferrule assembly to either of an inline board-mounted connector body and a transverse board-mounted connector body.

A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

A package, able to encapsulate at least one component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of the side walls includes exterior electrical connection elements linked electrically to the interior of the cavity, the exterior connection elements able to interconnect with an exterior circuit such that the side wall faces the exterior circuit when the exterior connection elements are interconnected with the circuit.