A stretchable mounting substrate that includes: a stretchable wiring substrate, the stretchable wiring substrate including a stretchable base material and a stretchable wiring arranged on the stretchable base material; and a module on a surface of the stretchable wiring substrate, the module including a multilayer substrate, a plurality of electronic components on a principal surface of the multilayer substrate, a plurality of first electrodes and a plurality of second electrodes, and internal wirings inside the multilayer substrate. The module has a first electrode arrangement region where the plurality of first electrodes are arranged and a second electrode arrangement region where the plurality of second electrodes are arranged, and includes a node electrode pair, and the internal wiring of the node electrode pair and the stretchable wiring on the stretchable base material intersect each other in plan view of the stretchable wiring substrate.

Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.

A substrate module according to an embodiment of the present invention comprises: a first substrate which includes transformer connection part to be connected to terminals of a transformer, at least one second substrate on which a switch module to be connected to the transformer is formed; and a conductive connector which connects the first substrate and the second substrate to each other, wherein the first substrate and the second substrate are arranged by the conductive connector such that a predetermined angle is formed therebetween.

An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.

An electronic device includes a circuit board having a signal detection terminal disposed on a first surface thereof and a ground terminal disposed on a second surface thereof and extending vertically so that the first surface and the second surface face each other in a horizontal direction, a monitoring terminal connected with the signal detection terminal, and a microcontroller unit (MCU) determining whether there is submersion by monitoring a voltage at the monitoring terminal. According to the present embodiments, it is possible to prevent hypersensitivity-induced misdetection due to condensation and dew. It is also possible to stepwise respond to submersion and determine whether the monitoring circuit normally operates to precisely detect submersion.

In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).

In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.

A battery pack includes a housing, and a battery cell or battery cell assembly and a circuit board that are disposed in the housing, and further includes: a first electrical connector connecting one of the positive and negative electrodes of the battery cell or battery cell assembly to the circuit board; a second electrical connector connecting the other one of the positive and negative electrodes of the battery cell or battery cell assembly to the circuit board; and a third electrical connector disposed on the circuit board and adapted to be electrically connected to an external electrical device to supply power from the battery cell to the electrical device through the third electrical connector. The third electrical connector includes a socket terminal in press fit with a pin terminal of the external electrical device. The technical solution involves supplying power from the battery cell to the electrical device.

A battery pack includes a housing, and a battery cell or battery cell assembly and a circuit board that are disposed in the housing, and further includes: a first electrical connector connecting one of the positive and negative electrodes of the battery cell or battery cell assembly to the circuit board; a second electrical connector connecting the other one of the positive and negative electrodes of the battery cell or battery cell assembly to the circuit board; and a third electrical connector disposed on the circuit board and adapted to be electrically connected to an external electrical device to supply power from the battery cell to the electrical device through the third electrical connector. The third electrical connector includes a socket terminal in press fit with a pin terminal of the external electrical device. The technical solution involves supplying power from the battery cell to the electrical device.