A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

The present invention relates to a method for producing radio frequency identification devices (RFID) without personalized chip, in particular the production of RFID tags without personalized chip, also referred to as chipless RFID tags. The present invention also relates to devices and labels produced by the claimed method as well as to systems for producing said devices/labels.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

A method for manufacturing a wiring board in which the adhesion between an underlayer and a seed layer is improved. A diffusion layer in which an element forming the underlayer and an element forming a coating layer are mutually diffused is formed between the underlayer and a wiring portion of the coating layer by irradiating the wiring portion with a laser beam. A seed layer is formed by removing a portion excluding the wiring portion of the coating layer from the underlayer. A metal layer is formed by disposing a solid electrolyte membrane between an anode and the seed layer and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from an insulating substrate.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

A method for depositing a functional material on a substrate is disclosed. An optically transparent plate having a first surface and a second surface with one or more wells is provided. After coating the second surface with a thin layer of light-absorbing material, the wells are filled with a functional material. The plate is then irradiated with a pulsed light to heat the layer of light-absorbing material in order to generate gas at an interface between the layer of light-absorbing material and the functional material to release the functional material from the wells onto a receiving substrate located adjacent to the plate.

A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

A method and structure for forming conductive structure such as an electric circuit, or a portion of an electric circuit, can include the use of a thermal print head and a ribbon including a carrier and a metal layer. The thermal print head is used to print a first portion of the metal layer onto a sacrificial print medium. The first portion printed has a first pattern, where a second portion having a second pattern remains on the carrier. The first pattern is a reverse image at least a portion of the electric circuit, while the second pattern includes at least a portion of the electric circuit. The second portion having the second pattern can be transferred to a circuit substrate, then used as an electric circuit.