An apparatus and method for reducing differential cross-talk in a pin arrangement of a socket are described. Socket pins within a differential pair use a modified shape to tighten the intra-pair pin coupling to reduce the crosstalk without changing the pin map. The middle vertical segment of one pin of a diagonally adjacent differential pin pair is modified to be closer to the other pin than other corresponding locations of the pins. The spring beam that extends from the middle vertical segment of the one pin is modified to accommodate the package landing pad that the spring beam contacts to maintain a uniform pitch.

A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.

The present invention discloses an ejector pin device for chip packaging, which comprises a pin cylinder, a base and an ejector pin base module, wherein the pin cylinder sleeves the ejector pin base module, the base is located below the ejector pin base module and is configured to fix the ejector pin base module; and the ejector pin base module comprises a knob unit and a supporting unit. An effect of adjusting the knob unit can be acted on the corresponding supporting unit, so that the requirements of the numbers and positions of the ejector pins required by different products are satisfied and metal foreign matters are reduced, thereby improving the efficiency of replacing products by a worker.

An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

A socket connector device for mating with a central processing unit having conductive portions is provided. The socket connector device includes a circuit module, a terminal module, and a cover plate. The terminal module is placed on the circuit module. The terminal module includes a terminal block. The terminal module includes a terminal block, multiple rows of terminals integrally formed with the terminal block, and a support housing protecting the terminal block. Each terminal includes a first contact end and a second contact end corresponding to each other. The second contact end protrudes from the support housing. Each first contact end electrically contacts one conductive portion, and each second contact end electrically contacts the circuit module. The cover plate is rotatably assembled on the terminal module, so that the conductive portions of the central processing unit electrically contact or do not contact the terminals of the terminal block.

Disclosed is a socket apparatus for gripping the balls of a ball grid array (BGA), including a base member of electrically insulative material, an array of pairs of electrical contacts disposed in the base member in a configuration corresponding to a terminal ball configuration of said BGA to be mated with the socket apparatus, a first plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, a second plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, the plurality of parallel extension members of said first plate member disposed between the plurality of parallel extension members of said second plate member, a plurality of insulative nodules disposed on each extension member with nodules forming an array corresponding to said array of pairs of electrical contacts, and the first plate member and second plate member being movable relative to each other on said base member whereby the plurality of insulative nodules urge the corresponding electrical contacts into electrical contact engagement with the balls of a BGA in the socket.

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.