A cooling structure includes: a main body including a base, and heat dissipation fins and a protrusion that protrude from a heat dissipation surface; a lid member disposed to cover the protrusion and the fins and form a flow path; and a fan mechanism. The fan mechanism includes a vane portion, a driving portion that rotates the vane portion, and a conductive wire for supplying electric power to the driving portion. The protrusion includes a first through hole, and the base includes a second through hole communicating with the first through hole. The conductive wire includes a first portion connected to the driving portion and disposed between the lid member and the main body, and a second portion continuing from the first portion and inserted in the first through hole and the second through hole. The cooling structure enables enhancement of the heat dissipation and shielding performance.

An electronic device including a substrate, a first electronic component provided on the substrate, a heat sink attached to the substrate, and a first heat conductive member located between the first electronic component and the heat sink and conducting heat of the first electronic component, in which the first heat conductive member includes a plastic heat conductor and an elastic heat conductor, and the plastic heat conductor and the elastic heat conductor are in contact with each other.

A display assembly includes a housing which at least partially encloses an image assembly. A cover positioned forward of, and spaced apart from, the image assembly forms at least a portion of a forward surface of the housing and permits viewing of images displayed at the image assembly therethrough. A fan assembly moves air through an airflow pathway within the housing which includes a front channel between the cover and the image assembly and a rear chamber behind the image assembly. One or more solar energy reduction layers are associated with the cover and prevent at least some ambient sunlight striking the cover from traveling therebeyond.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

A heat sink assembly includes a casing having an opening, a main board accommodated in the casing, a heat sink mounted on the main board, an electrical connector mounted on the main board and exposed in the opening, a mating connector located outside the casing and connected to the electrical connector through the opening in a plugging manner, and a heat conductor, disposed inside the casing. The mating connector has a chip that is electrically connected to the electrical connector. One end of the heat conductor is connected to the heat sink, and the other end of the heat conductor is thermally connected to the electrical connector or the mating connector, so that heat generated by the chip during working can be transferred to the heat sink through the heat conductor, thereby reducing a temperature of the mating connector.

An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.

Information handling system (IHS) component immersion cooling systems and methods employ an apparatus having an IHS component immersion cooling flow passage housing disposed at (a) IHS component(s) of an IHS disposed in an immersion cooling tank. The IHS component immersion cooling flow passage housing has an immersion fluid inlet open to immersion fluid within tank and an immersion fluid outlet connected to a return line of an immersion fluid pump. The IHS component cooling apparatus flow passage housing may be a cold plate or a ducted heatsink disposed on, or about, the IHS component(s) of the IHS disposed in the immersion cooling tank. The immersion fluid pump may be the pump that also circulates the immersion fluid within the tank. The tank may include a manifold in fluid flow communication with the pump. This manifold may receive a plurality of return lines, each from an IHS component cooling apparatus.

A set of electronic package elements intended to be mounted on an electronic board having a component to be cooled including: a chassis, a heatsink fixed by a retaining piece inside the chassis, a cover configured to be fixed on the chassis so as to retain the electronic board in the package. The heatsink is configured to be fixed on the electronic board while maintaining a predetermined distance between a lower face of the heatsink and the component. The cover is configured to be able to be fixed by a fixing point to the heatsink. The retaining piece is connected to the heatsink so as to allow the heatsink a translational movement relative to the chassis in three orthogonal directions.

Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

In one embodiment, a method for managing a heatsink of an information handling system includes: determining, by a controller unit of the information handling system, that a vibration event is to occur, the vibration event associated with a vibration unit of the information handling system, the controller unit communicably coupled to the vibration unit, the vibration unit removably coupled to the heatsink; and causing, by the controller unit, the vibration unit to generate the vibration event, the vibration event causing the vibration unit to apply one or more vibrations to the heatsink, the one or more vibrations causing a boundary layer of particles to be removed from a surface of the heatsink.