H01G4/12

Dielectric material having improved DC bias dielectric constant and multilayer ceramic electronic component using the same

A dielectric material includes a main component represented by (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yZr.sub.y)O.sub.3, (Ba.sub.1-xCa.sub.x)(Ti.sub.1-ySn.sub.y)O.sub.3, or (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yHf.sub.y)O.sub.3 (0≤x≤1 and 0≤y≤0.05) and a subcomponent. When an angle corresponding to a maximum peak is referred to as θ.sub.0 and angles corresponding to a full width at half maximum (FWHM) are respectively referred to as θ.sub.1 and θ.sub.2 (θ1<θ2) in the peaks of (002) and (200) plane of an x-ray diffraction (XRD) pattern using Cu Kα1 radiation (wavelength Δ=1.5406 Å), (θ.sub.2−θ.sub.0)/(θ.sub.0−θ.sub.1) is greater than 0.54 to 1.0 or less.

Multilayer ceramic electronic component
11569038 · 2023-01-31 · ·

A multilayer ceramic electronic component includes first and second multilayer ceramic electronic component bodies facing each other in a length direction that connects first and second end surfaces. A first metal terminal is connected to a first outer electrode. A second metal terminal is connected to a fourth outer electrode. An outer casing covers the first and second multilayer ceramic electronic component bodies, and at least a portion of each of the first and second metal terminals. A third metal terminal is exposed from the outer casing.

Ceramic electronic component and method of manufacturing the same

A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.

Dielectric ceramic composition and electronic component

Provided is a dielectric ceramic composition comprising a main component of forsterite and calcium strontium titanate. A content ratio of forsterite in the main component is from 84.0 to 92.5 parts by mole, and a content ratio of calcium strontium titanate is from 7.5 to 16.0 parts by mole. (Sr+Ca)/Ti in the calcium strontium titanate is from 1.03 to 1.20 in terms of a molar ratio. With respect to a total of 100 parts by mass of the main component and a subcomponent except for Li-containing glass, from 2 to 10 parts by mass of Li-containing glass is added. The Li-containing glass includes Al.sub.2O.sub.3 in an amount of from 1% by mass to 10% by mass.

Ceramic electronic device
11569035 · 2023-01-31 · ·

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. A relationship of “I.sub.A/I.sub.B>0.30” is satisfied and a peak current value I.sub.B is 100 pA/mm.sup.2 or less in a TSDC in which a polarizing temperature is 150 degrees C., a polarizing electric field is 15 V/μm to 20 V/μm, a polarizing time is 60 minutes, and an increasing speed of temperature is 10° C./minute, when a peak current of a low temperature side of a temperature range of 160 degrees C. or more and less than 230 degrees C. is I.sub.A and a peak current of a high temperature side of a temperature range of 230 degrees C. or more and 350 degrees C. or less is I.sub.B.

MULTILAYER ELECTRONIC COMPONENT
20230238184 · 2023-07-27 · ·

A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 μm or more.

MULTILAYER ELECTRONIC COMPONENT
20230238184 · 2023-07-27 · ·

A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 μm or more.

THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR

A three-terminal multilayer ceramic capacitor includes at least one surface electrode layer on a surface of a second internal electrode layer connected to a lateral surface external electrode. The surface electrode layer includes at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y or Cu, which is different from a main component of the second internal electrode layer.

HIGH VOLTAGE FEED-THROUGH CAPACITOR
20230023226 · 2023-01-26 · ·

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

HIGH VOLTAGE FEED-THROUGH CAPACITOR
20230023226 · 2023-01-26 · ·

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.