A MESFET transistor on a horizontal substrate surface with at least one wiring layer on the substrate surface. The transistor comprises source, drain and gate electrodes which are at least partly covered by a semiconducting channel layer. The source, drain and gate electrodes optionally comprise interface contact materials for changing the junction type between each electrode and the channel. The interface between the source electrode and the channel is an ohmic junction, the interface between the drain electrode and the channel is an ohmic junction, and the interface between the gate electrode and the channel is a Schottky junction. The substrate is a CMOS substrate.

An electronic device can include a HEMT including at least two channel layers. In an embodiment, a lower semiconductor layer overlies a lower channel layer, wherein the lower semiconductor layer has an aluminum content that is at least 10% of a total metal content of the lower semiconductor layer. An upper semiconductor layer overlies the upper channel layer, wherein the upper semiconductor layer has an aluminum content that is greater as compared to the lower semiconductor layer. In another embodiment, an electronic device can include stepped source and drain electrodes, so that lower contact resistance can be achieved. In a further embodiment, an absolute value of a difference between pinch-off or threshold voltages between different channel layers is greater than 1 V and allows current to be turned on or turned off for a channel layer without affecting another channel layer.

A high electron mobility transistor (HEMT) includes a semiconductor structure including a cap layer and a channel layer forming a heterojunction, such that a two dimensional electron gas is formed at the interface of cap layer and the channel layer. The HEMT also includes a set of electrodes including a source electrode, a drain electrode, and a gate electrode deposited on the cap layer. The gate electrode is arranged between the source and the drain electrode along the length of the HEMT. The thickness of the cap layer at least under the gate electrode is varying along the width of the HEMT.

The present invention improves the linearity characteristics of a transistor, namely the input/output intercept points (IIP3/OIP3) and intermodulation distortion (IM3), while maintaining a high transconductance and high electron velocity in the conducting channel. The present invention also improves the manufacturability, yield, and immunity to bias-point drift, of a linear transistor. In one embodiment, the present invention implements triple pulse doping or even higher pulse doping for immunity to process variation as well as low parasitic leakage. In an alternative embodiment, the present invention implements a bilinear V-shaped composition grading for engineering the I.sub.D-V.sub.GS curve for high OIP3. In another alternative embodiment, the present invention implements a quadratic or U-shaped composition grading for engineering the I.sub.D-V.sub.GS curve for high OIP3.

A semiconductor structure having a multiple-porous graphene layer includes a sapphire substrate, a single or multiple layer porous graphene film, and a gallium nitride layer. A fabrication method for forming the semiconductor structure having a single or multiple layer porous graphene film, includes: firstly, growing up the graphene on the copper foil; then, using the acetone and isopropyl alcohol to wash the sapphire substrate, and then using the nitrogen flow to dry up; transferring the graphene onto the semiconductor substrate, using the Poly(methyl methacrylate) to fix the single or multiple layer porous graphene film, and using the acetone to wash up; using the photolithography process to etch the whole surface of the multiple-porous graphene layer; and, using the metalorganic chemical vapor deposition to deposit gallium nitride on the single or multiple layer porous graphene film and the sapphire substrate.

Presented is a lateral fin static induction transistor including a semi conductive substrate, source and drain regions extending from an optional buffer layer of same or varied thickness supported by the semi conductive substrate, a semi conductive channel electrically coupling the source region to the drain region of the transistor, a portion of the semi conductive channel being a fin and having a face covered by a gated structure, thereby defining a gated channel within the semi conductive channel, the semi conductive channel further including a drift region electrically coupling the gated channel to the drain region of the transistor.

A semiconductor device and method for fabricating the same are provided. The semiconductor device includes a substrate including a cell region, a core region, and a boundary region between the cell region and the core region, a boundary element isolation layer in the boundary region of the substrate to separate the cell region from the core region, a high-k dielectric layer on at least a part of the boundary element isolation layer and the core region of the substrate, a first work function metal pattern comprising a first extension overlapping the boundary element isolation layer on the high-k dielectric layer, and a second work function metal pattern comprising a second extension overlapping the boundary element isolation layer on the first work function metal pattern, wherein a first length of the first extension is different from a second length of the second extension.

A transistor includes a substrate, a channel layer coupled to the substrate, a source electrode coupled to the channel layer, a drain electrode coupled to the channel layer, and a gate electrode coupled to the channel layer between the source electrode and the drain electrode. The gate electrode has a length dimension of less than 50 nanometers near the channel layer, and the channel layer includes at least a first GaN layer and a first graded AlGaN layer on the first GaN layer.

Presented is a lateral fin static induction transistor including a semi conductive substrate, source and drain regions extending from an optional buffer layer of same or varied thickness supported by the semi conductive substrate, a semi conductive channel electrically coupling the source region to the drain region of the transistor, a portion of the semi conductive channel being a fin and having a face covered by a gated structure, thereby defining a gated channel within the semi conductive channel, the semi conductive channel further including a drift region electrically coupling the gated channel to the drain region of the transistor.

A TFT and a method for manufacturing the same, an array substrate and a display device are provided. The TFT includes a first electrode pattern and a second electrode pattern arranged at an identical layer. The first electrode pattern includes a first strip-like portion extending in a first direction, and the second electrode pattern includes a bending portion surrounding a first end of the first strip-like portion. The second electrode pattern further includes a second strip-like portion extending from a first end of the bending portion in the first direction. A channel formation region of the TFT includes a region between the bending portion and the first strip-like portion, and a region between the second strip-like portion and the first strip-like portion.