A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other, having at least one dielectric layer interposed therebetween in a first direction; and first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to the at least one first internal electrode and the at least one second internal electrode. The body further includes a cover layer disposed to overlap the capacitance region in the first direction, and 1.11 or more is a value obtained by dividing a sum of respective major-axis lengths Lx of a plurality of crystal grains included in the cover layer by a sum of respective minor-axis lengths Sx of the plurality of crystal grains.

A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a first direction, first and second side margin portions respectively disposed on surfaces of the body in a third direction, and external electrodes respectively disposed on surfaces of the body in a second direction. The first side margin portion includes first dielectric grains, the dielectric layer includes second dielectric grains, and in cross-sections of the first side margin portion and the body in the first and third directions, a ratio of a major axis length to a minor axis length of the first dielectric grain is 3 or greater and 30 or less, and a ratio of a major axis length to a minor axis length of the second dielectric grain is 1.5 or less.

A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion extending from the first connection portion onto the first surface, and a third band portion extending from the first connection portion onto the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion extending from the second connection portion onto the first surface, and a fourth band portion extending from the second connection portion onto the second surface; an insulating layer including oxide including aluminum (Al), disposed on the first and second connection portions, and covering the second surface and the third and fourth band portions; and first and second plating layers respectively disposed on the first and second band portions.

A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.

A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.

A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a third band portion extending from the first connection portion to a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a fourth band portion extending from the second connection portion to a portion of the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions; the insulating layer includes an oxide including zirconium (Zr).

A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface, and third and fourth band portions; and first and second plating layers respectively disposed on the first and second band portions. The insulating layer includes an oxide containing Ti. The dielectric layer includes one of BaTiO.sub.3, (Ba.sub.1-xCa.sub.x) TiO.sub.3 (0<x<1) , Ba(Ti.sub.1-yCa.sub.y)O.sub.3 (0<y<1) , (Ba.sub.1-xCa.sub.x) (Ti.sub.1-yZr.sub.y)O.sub.3 (0<x<1, 0<y<1) and Ba(Ti.sub.1-yZr.sub.y)O.sub.3 (0<y<1) as a main component.

A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein A.sub.V indicates a total area of the at least one hole, A.sub.B indicates an area of the one surface of the first or second bump, facing the first or second external electrode, and A.sub.V/A.sub.B is greater than 0.012 and less than 0.189.