A multi-layer ceramic electronic component includes: a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces on which end portions of the internal electrodes in a direction of a second axis orthogonal to the first axis are positioned; and first and second side margins that cover the first and second side surfaces, respectively. When the first and second side margins are each divided equally into first and second regions along a plane perpendicular to the direction of the first axis, the first side margin has a larger average thickness in the first region than in the second region, and the second side margin has a larger average thickness in the second region than in the first region.

A multilayer electric component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween and external electrodes disposed on the body and connected to the internal electrodes, wherein the internal electrodes include Cu and Ni and a coefficient of variation (CV) value of Cu/Ni (percent by weight) in a region thereof, 5 nm deep from an interface with the dielectric layer is 25.0% or less.

A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

A dielectric material, a device including the same, and a method of preparing the dielectric material are provided. The dielectric material may include a compound represented by the following Formula 1:

K.sub.1+xNaSr.sub.4-2xLa.sub.xNb.sub.10O.sub.30,  Formula 1

wherein, in Formula 1, 0<x<2.

A capacitor component includes a body including a layered portion having alternately stacked first and second internal electrodes laminated with dielectric layers interposed therebetween in a first direction, and first and second connecting portions disposed on two opposing surfaces of the layered portion, respectively, in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes, respectively. The first and second connecting portions each include a metal layer disposed on the layered portion, a ceramic layer disposed on the metal layer, and an exposed portion penetrating through the ceramic layer to be in contact with the metal layer.

A ceramic electronic device includes, a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, external electrodes provided on the first end face and the second end face, and a water repellent agent formed on a surface of the external electrodes. A thickness A (>0) of the water repellent agent on at least one of four faces of the external electrodes that cover an upper face in a stacking direction, a lower face in the stacking direction, and two side faces of the multilayer chip is larger than a thickness B (>0) of the water repellent agent on faces of the external electrodes that cover the first end face and the second end face.

A nanoparticle cluster reduction method yields a new composition of matter including a large percentage (e.g., 75% or higher percentage) of primary nanoparticles in the new composition of matter. The particle reduction method reduces the size of nanoparticle clusters in material of the new composition of matter, allows particle reduction of specific nanoparticle cluster sizes, and allows particle reduction to primary nanoparticles. This new composition of matter can include a high permittivity and high resistivity dielectric compound. This new composition of matter, according to certain examples, has high permittivity, high resistivity, and low leakage current. In certain examples, the new composition of matter constitutes a dielectric energy storage device that is a battery with very high energy density, high operating voltage per cell, and an extended battery life cycle. An example method can include a controlled gas evolution reaction to reduce the size of nanoparticle clusters.

A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure. A bent portion, in which the plurality of dielectric layers in a substantially same position along a stacking direction project along the stacking direction, is formed in the multilayer chip. In the bent portion, a through-hole is formed in two or more of the plurality of internal electrode layers. The through-hole is a defect portion in a first direction in which the first end face faces with the second end face and in a second direction that is vertical to the first direction in a plane of the plurality of internal electrode layers.

A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.