Patent classifications
H01G4/1254
PERSONALIZED INVESTMENT PORTFOLIO
A method for establishing a personalized investment portfolio comprising the steps of starting from a client's investor behavior and experience establishing a client profile based on questions regarding the client's behavior of daily life and investment approach and experience to provide a behavioral profile; constructing a computer program model to determine optimal asset class allocation for each client profile covering a wide range of assets, including real estate, insurance, arts and traditional financial asset classes as a holistic asset allocation; and establishing a model of a personalized ranking of financial investment products for a client investor, based on product characteristics and investor profile with a best fit investment program.
Transfer-free method for producing graphene thin film
The present invention relates to a transfer-free method for producing a graphene thin film, which may form a high-quality graphene layer having excellent crystallinity on a substrate without a transfer process, and to a method of fabricating a device using the transfer-free method. More specifically, the present invention relates to a transfer-free method for producing a graphene thin film and a method for fabricating a device using the transfer-free method, the methods including the steps of: (A) forming a titanium buffer layer on a target substrate; and (B) growing a graphene thin film on the titanium buffer layer, wherein process are performed in an oxygen-free atmosphere throughout the steps (A) to (B).
Dielectric ceramic composition and ceramic electronic component
According to the present invention, a dielectric ceramic composition, which can be fired in a reducing atmosphere, has a high dielectric constant, has an electrostatic capacity exhibiting little change, when used as a dielectric layer of a ceramic electronic component such as a laminated ceramic capacitor even under a condition of 150 to 200° C., and has small dielectric losses at 25° C. and 200° C., can be provided.
Thin film capacitor
A thin film capacitor includes a first electrode layer (10), a dielectric layer (20) stacked on the first electrode layer (10), and a second electrode layer (30) stacked on the dielectric layer (20), wherein the dielectric layer (20) includes a layered void aggregation region (22) which extends in a direction orthogonal to a stacking direction.
Metal oxynitride thin film, process for producing metal oxynitride thin film, and capacitor element
A metal oxynitride thin film having a perovskite structure, in which the metal oxynitride thin film has a composition represented by a compositional formula A.sub.1+αBO.sub.x+αN.sub.y wherein α is larger than zero and 0.300 or less, x+α is larger than 2.450, and y is 0.300 or more and 0.700 or less, an AO structure having a layered structure parallel to a plane perpendicular to a c-axis of the perovskite structure and having a composition represented by a general formula AO, and the AO structure is bonded with the perovskite structure and incorporated in the perovskite structure.
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD
A thin film capacitor for which electrode conductivity is high and electrode irregularities are unlikely to be generate even if the capacitor if heated up to 700° C. This thin film capacitor has a first electrode, a dielectric layer, and a second electrode. The dielectric layer contains an ABO.sub.2N-type oxynitride. The nitrogen concentration of the part of the dielectric layer that contacts the first electrode is no more than half the nitrogen concentration of the center part of the dielectric layer.
DIELECTRIC THIN FILM, CAPACITOR ELEMENT, AND ELECTRONIC CIRCUIT BOARD
A capacitive element and a dielectric thin film having a small dielectric loss and a large relative permittivity, particularly at low frequencies. [Solution] This dielectric thin film includes an A-B—O—N oxynitride. When the A-B—O—N oxynitride is represented by the compositional formula A.sub.aB.sub.bO.sub.oN.sub.n, (o+n)/a<3.00 is satisfied.
Ceramic electronic component including ceramic nanosheets having multimodal lateral size distribution and method of manufacturing the same and electronic device
A ceramic electronic component includes a pair of electrodes facing each other and a dielectric layer disposed between the pair of electrodes and including a plurality of ceramic nanosheets, where the plurality of ceramic nanosheets has a multimodal lateral size distribution expressed by at least two separated peaks, a method of manufacturing the same, and an electronic device including the ceramic electronic component.
Dielectric composition and electronic component
Provided is a dielectric composition which includes, as a main component, a complex oxide represented by a general formula A.sub.aB.sub.bC.sub.4O.sub.15+α and having a tungsten bronze structure, wherein “A” includes at least Ba, “B” includes at least Zr, “C” includes at least Nb, “a” is 3.05 or higher, and “b” is 1.01 or higher. In the dielectric composition, when the total number of atoms occupying M2 sites in the tungsten bronze structure is set to 1, the proportion of “B” is 0.250 or higher. In addition, in the dielectric composition, an X-ray diffraction peak of a (410) plane of the tungsten bronze structure is splitted into two, and an integrated intensity ratio of an integrated intensity of a high-angle side peak of the X-ray diffraction peak with respect to an integrated intensity of a low-angle side peak of the X-ray diffraction peak is 0.125 or higher.
THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN FILM CAPACITOR MANUFACTURING METHOD
Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.