A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO.sub.3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.

A multilayer electronic component that includes a plurality of stacked dielectric layers, each of the plurality of stacked dielectric layers having a plurality of crystal grains, at least some of the plurality of crystal grains having a trap portion therein, and at least one element selected from the group consisting of Ni, Cu, Pt, Sn, Pd and Ag is present locally in the trap portion; and a plurality of internal electrode layers arranged between adjacent dielectric layers of the plurality of stacked dielectric layers.

A conductive powder for an internal electrode includes a metal particle and a graphene oxide disposed on at least a portion of a surface of the metal particle. A content of the graphene oxide is less than 1.0 weight percent, based on a weight of the metal particle.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

A method of producing a dielectric material by preparing a slurry by mixing a dielectric powder, water, one of an organic-acid metal salt and an inorganic metal salt, and an organic silicon compound, causing the slurry to come into contact with an anion exchange resin to remove an anion derived from the one of the organic-acid metal salt and the inorganic metal salt from the slurry, and drying the slurry to obtain the dielectric material.

A multilayer ceramic capacitor includes a laminate and

an external electrode connected to the internal electrode layer. The laminate includes a central layer portion in which an internal electrode layer and a dielectric ceramic layer are alternately laminated, and a covering portion covering an outer surface of the central layer portion in the lamination direction and the width direction. A region where the main surface meets the lateral surface in the laminate is defined as a corner portion that is rounded, and a distance from the corner portion to an internal electrode closest to the corner portion is about 20 .Math.m or less.

A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

The insulating member is integrated with only one of the busbars by insert molding in which one of opposing plate members in either one of the busbars is used as an insert target. The insulating member includes an insulation active portion, a reinforcing portion and a connecting portion. The insulation active portion is disposed on a back-surface side of one of the opposing plate portions and is interposed between the back-surface side and the other one of the opposing plate portions. The reinforcing portion is disposed on the front-surface side of the one of the opposing plate portions.

The connecting portion serves to connect the insulation active portion and the reinforcing portion into an integral unit. In the insulating member, lower end regions of the insulation active portion, reinforcing portion and connecting portion, which are close to the capacitor element and extending from an upper-surface side to a lower-surface side of a side plate portion, are embedded in a mold resin that covers the side plate portion.

A structural body that includes: a substrate; a plurality of fibrous materials, each of the plurality of fibrous material including a fibrous core material and a covering layer that covers the fibrous core material such that an exposed portion of the fibrous core material is formed at an end portion thereof; and an adhesive layer that bonds the substrate and the end portion of each of the plurality of fibrous materials to each other such that a boundary between the covering layer and the exposed portion is located inside the adhesive layer.

A dielectric material includes a main component represented by (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yZr.sub.y)O.sub.3, (Ba.sub.1-xCa.sub.x)(Ti.sub.1-ySn.sub.y)O.sub.3, or (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yHf.sub.y)O.sub.3 (0≤x≤1 and 0≤y≤0.05) and a subcomponent. When an angle corresponding to a maximum peak is referred to as θ.sub.0 and angles corresponding to a full width at half maximum (FWHM) are respectively referred to as θ.sub.1 and θ.sub.2 (θ1<θ2) in the peaks of (002) and (200) plane of an x-ray diffraction (XRD) pattern using Cu Kα1 radiation (wavelength Δ=1.5406 Å), (θ.sub.2−θ.sub.0)/(θ.sub.0−θ.sub.1) is greater than 0.54 to 1.0 or less.