A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately stacked on one another, and two external electrodes respectively on two end surfaces of the multilayer body. Each of the dielectric layers includes, at a location coincident with an end portion of a respective one of the internal electrodes, a thick-walled portion thicker in a stacking direction than a portion corresponding in position to a middle portion of a main surface of the multilayer body. When viewed in the stacking direction, positions of some of the thick-walled portions of the dielectric layers are out of alignment with positions of a remainder of the thick-walled portions of the dielectric layers.

A multilayer ceramic electronic component includes a multilayer body including ceramic layers that are laminated, first and second internal electrode layers respectively on the ceramic layers and exposed to first and second end surfaces, first and second external electrodes respectively connected to the first and second internal electrode layers. The first and second external electrodes include a base electrode layer including at least one of Ni, Cr, Cu, or Ti and a plating layer including lower, middle, and upper layer plating layers. A particle diameter of a metal included in the lower layer plating layer is larger than a particle diameter of a metal included in the middle layer plating layer.

A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers and internal electrode layers laminated alternately in a lamination direction, and a pair of external electrodes on both end portions in the length direction of the multilayer body and respectively connected to the internal electrode layers. The pair of external electrodes each include a base region covering at least each of the first and second end surfaces and connected to the internal electrode layers, and a cover region on the base region to cover the base region. The cover region includes maximum thickness portions each including a maximum thickness in the cover region, in a region corresponding to the ranges of about ±10 μm in the lamination direction centered around internal electrode layers at both outermost ends in the lamination direction among the internal electrode layers.

A multi-layer ceramic electronic component includes (I) a ceramic body including (i) a protective portion that includes an end surface facing in a first direction, circumferential surfaces, and a ridge including a recess extending along the first direction and connects the circumferential surfaces, and (ii) a functional portion including internal electrodes laminated in a second direction, and (II) an external electrode including (i) a base film covering the end surface and including a first, second, and third covering portions formed on the end surface, on the circumferential surfaces, and on the recess, respectively, (ii) an intermediate film formed on the base film and continuously covering the first, second, and third covering portions, and (iii) a surface film formed on the intermediate film, wherein the recess is disposed outside end portions of the internal electrodes in a third direction orthogonal to the first and second directions.

A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

A multilayer ceramic electronic device includes a multilayer chip having a plurality of internal electrode layers that face each other and a plurality of dielectric layers, each of which is sandwiched by two of the plurality of internal electrode layers, one end of at least one of the plurality of internal electrode layers being exposed at a side face of the multilayer chip, a first external electrode that is provided on the side face of the multilayer chip, is in contact with at least one of the each end of the plurality of internal electrode layers, and includes ceramic grains, and a second external electrode that is provided on the first external electrode, has a glass, and has a main component that is a same metal as that of the first external electrode.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 μm or more and 30 μm or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 μm or more and 15 μm or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 μm or more and 10 μm or less.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

Provided is a method of producing fine particulate barium calcium titanate in which calcium forms a homogeneous solid solution. The present invention relates to a method of producing a perovskite compound represented by the following formula (1):

Ba.sub.(1-x)A.sub.xTiO.sub.3  (1)

wherein A represents Ca or Sr, and x is a number satisfying 0.00<x≤0.30,

the method including: a first step of acid washing barium titanate to provide barium titanate having a ratio of barium element to titanium element of lower than 1.00; a second step of mixing the barium titanate obtained in the first step and a calcium salt or a strontium salt and drying the mixture to provide a dry mixture; and a third step of heating the dry mixture obtained in the second step.

A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other and an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other.