H01G4/1245

MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

A multilayer ceramic electronic device includes a plurality of internal electrode layers that face each other; and a plurality of dielectric layers, each of which is sandwiched by each two of the plurality of internal electrode layers. A main component of the plurality of dielectric layers is barium titanate zirconate. In each of the plurality of dielectric layers, an amount of zirconium is 2 at % or more and 14 at % or less with respect a total amount of titanium and zirconium. Curie point of the plurality of dielectric layers is less than 85 degrees C. An average thickness of each of the plurality of dielectric layers is 1 μm or less.

Dielectric ceramic composition and ceramic capacitor using the same

A dielectric ceramic composition comprising a main component comprising an oxide represented by:
U.sub.aX.sub.bY.sub.cZ.sub.d((Ca.sub.1-x-ySr.sub.xM.sub.y).sub.m(Zr.sub.1-u-vTi.sub.uHf.sub.v)O.sub.3).sub.1-a-b-c-d
wherein the elements defined by U, X, Y, Z and M and subscripts a, b, c, d, x, y, m, u and v are defined.

MULTILAYER CAPACITOR

A multilayer capacitor is provided. The multilayer capacitor includes a body and an external electrode disposed outside the body, wherein the body includes an active portion including a plurality of dielectric layers and a plurality of internal electrodes stacked with dielectric layers interposed therebetween, and a side margin portion covering at least one side surface of side surfaces to which the internal electrodes are exposed in the laminate, wherein the side margin portion includes a dielectric including a BaTiO.sub.3-based main component, a first subcomponent including a rare earth element, and a second subcomponent including Zr, wherein, based on a molar content per 100 moles of the main component, when a molar content of the rare earth element is RE, a molar content of Zr and RE satisfies 0.20≤Zr/RE≤0.37.

MULTILAYER CERAMIC CAPACITOR
20230207216 · 2023-06-29 ·

A multilayer ceramic capacitor includes a multilayer body including ceramic layers, internal electrodes and a pair of side surfaces, and side margin portions, wherein each of ceramic layers and the side margin portions is composed of a polycrystalline body having a perovskite structure, wherein the side margin portions contain at least one of calcium and strontium, when the side margin portions contain calcium, an atomic ratio of the calcium to titanium in the side margin portions is greater than that in the ceramic layers, and when the side margin portions contains strontium, the atomic ratio of the strontium to titanium in the side margin portions is greater than that in the ceramic layers, wherein glass particles composed of silicon as a main component are dispersed in the polycrystalline body, and an atomic ratio of silicon to titanium is 1 at % or more and 10 at % or less.

METHOD AND APPARATUS FOR A THIN FILM DIELECTRIC STACK

A system that incorporates teachings of the subject disclosure may include, for example, a thin film capacitor having a substrate, a first electrode layer on the substrate, a first dielectric layer on the first electrode layer where the first dielectric layer has a columnar-oriented grain structure, a group of second dielectric layers stacked on the first dielectric layer where each of the group of second dielectric layers has a randomly-oriented grain structure, and a second electrode layer on the group of second dielectric layers. Other embodiments are disclosed.

Multilayer capacitor and board having the same mounted thereon

A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively connected to the third surface and the fourth surface of the capacitor body to be respectively connected to the first internal electrode and the second internal electrode. The first and second side portions include an acicular second phase including a glass including aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P).

ELECTRONIC COMPONENT
20170352479 · 2017-12-07 ·

An electronic component includes a multilayer body, first to fourth outer electrodes, a pair of first insulating coating portions, and a pair of second insulating coating portions. The pair of first insulating coating portions is in at least one of a state in which inner end portions are in contact with the third outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode. The pair of second insulating coating portions is in at least one of a state in which inner end portions are in contact with the fourth outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode.

Resonant Multilayer Ceramic Capacitors

Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC V.sub.PP wherein the rated AC V.sub.PP is higher than the rated DC voltage.

Thin film capacitor having a dielectric layer having a through hole whose inner surface has first and second tapered surfaces, circuit board incorporating the same, and thin film capacitor manufacturing method

Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.

Multilayer capacitor and board having the same mounted thereon

A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.