A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.

A method of calibrating a thermal sensor device is provided. The method includes extracting an incremental voltage to temperature curve for a diode array from a first incremental voltage of the diode array at a first temperature. The diode array and a device under test (DUT) which includes a thermal sensor are heated. After heating the diode array, a first incremental temperature is determined from the incremental voltage to temperature curve for the diode array and a second incremental voltage of the diode array after heating the diode array. An incremental voltage to temperature curve is extracted for the DUT from the first incremental temperature, a first incremental voltage for the DUT at the first temperature, and a second incremental voltage of the DUT after heating the device under test. A temperature error for the thermal sensor is determined from the incremental voltage to temperature curve for the DUT.

The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.

A test carrier that accommodates a device under test (DUT) and has a through-hole facing the DUT, including: a movable valve that: opens by suction through the through hole such that the DUT is sucked through the through hole.

An example test socket for a test system includes a receptacle to make electrical and mechanical connections to a device under test (DUT) and a lid to cover the DUT in the receptacle. The lid is controllable to open automatically to enable receipt of the DUT in the receptacle and, following receipt of the DUT, to close automatically to cover the DUT in the receptacle. Closing the lid applies force to the DUT to complete the electrical and mechanical connections between the test socket and the DUT.

An air blow guide member 100 for cooling an electrical component accommodated in an electrical component socket 10 is configured to guide flowing air K supplied from a ventilation unit 3 toward the electrical component socket 10. Further, a test device unit 2 including the air blow guide member 100 and the electrical component socket 10 is configured so that the flowing air K supplied from the air ventilation unit 3 is guided toward the electrical component socket 10 by the air blow guide member 100. Further, a test device includes a plurality of the test units 2 arranged from an upstream side toward a downstream side of the flowing air K supplied from the ventilation unit 3.

A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.