An inspection socket includes: a pin block that is configured to support a contact probe in a manner of exposing a tip end of the contact probe from an exposed surface and inclining the contact probe in a predetermined direction relative to a direction perpendicular to the exposed surface; and a pressing portion that is configured to press an inspection target IC package that is to come into contact with the contact probe.

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

A socket for electrically connecting a first electrical component, the upper surface of which is pressed upon by a pressing member, and a second electrical component which is positioned below the first electrical component, said socket being equipped with: a socket main body which has a placement surface on which the first electrical component is placed; and a holding part which is provided to the socket main body, holds the first electrical component to the socket main body by engaging the first electrical component in a pressed state in which the first electrical component is pressed upon by the pressing member, and releases the engagement with the first electrical component when the pressing member moves a prescribed distance away from the position which corresponds to the pressed state.

An apparatus for aligning a device having a fine pitch includes: a base plate, which has vacuum holes respectively formed at seating points for devices and suctions the devices with the vacuum pressure that allows minute movement as the vacuum pressure is applied in a state in which the devices are loaded; a jig plate, which is fixedly installed so as to be positioned on the upper portion of the base plate and has openings, in which the devices are received, in the same number as the number of the devices loaded on the base plate; and a base plate position adjusting means for finely moving the positions of the devices loaded on the base plate in X-Y-θ directions so as to position the devices in the openings (formed in the jig plate.

A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

The present disclosure relates to a device for carrying a chip, and a device and a method for testing a chip. The device for carrying a chip is configured to fasten chips of different sizes, and includes a support box and a plurality of first elastic snap rings. The support box is configured to carry a chip. A first connection terminal of the first elastic snap ring is provided on a first inner side wall of the support box, a second connection terminal of the first elastic snap ring is suspended, and is configured to be in contact with the chip and provide a pressure in a first direction for the chip because an elastic body of the first elastic snap ring is in an elastically compressed state.

Embodiments of the present application disclose a fixing device and fixing method for chip test and a chip tester. The fixing device for chip test includes: a carrier with a fixing chamber for fixing a chip formed inside, a plurality of adjustors being disposed on sidewalls of the fixing chamber and configured to be extended or retracted to adjust a position of the chip in two orthogonal directions within a horizontal plane; and a top cover configured to cooperate with the carrier to fix the chip in a vertical direction, wherein at least one adjustable pressing cover is disposed at a bottom of the top cover, so as to autonomously adjust a pressing force applied to the chip by the pressing cover in the vertical direction. The present application is suitable for fixing chips with various overall dimensions, and can adaptively adjust a pressing force.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

An opening/closing mechanism of a cover member that can easily push down the cover member by the lever member even if the force from the base member side to the cover member is increased, improving the operability of the lever member. A solution is that the lever member 17 is rotatably supported to the base member 23 by the first shaft 31, the link plate 29 is mounted to the lever member 17 by the second shaft 32, the cover member 15 is mounted to the link plate 29 by the third shaft 33, and the link plate 29 is rotated around the axis of the first shaft 31 in the direction in which the lever member 17 closes, so that the link plate 29 moves through the second shaft 32, and the link plate 29 moves, so that the cover member 15 is depressed through the third shaft 33.