Proposed is an outer cylindrical spring pin including a compression spring (30), and an integrated upper probe (10) integrally provided with an upper probe portion (11) for contacting the outside, and with two upper probe side wall portions (12) which extend from the upper probe portion (11) and which surround two side surfaces facing each other, among four side surfaces of the compression spring (30). The spring pin further includes an integrated lower probe (20) integrally provided with a lower probe portion (21) for contacting the outside, and with two lower probe side wall portions (22) which extend from the lower probe portion (21) and which surround other two side surfaces between the two side surfaces. When an external force is applied, the upper and lower probe side wall portions (12 and 22) are capable of being slid on each other while being in contact with each other.

A probe according to an embodiment is a probe used in inspecting an electronic device. The probe includes an end portion capable of contacting a surface of an electrode of the electronic device. The end portion has a recessed portion.

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node.

A Kelvin probe according to one or more embodiments includes first and second probe pins in parallel to each other with a space in between. Each of the first and second probe pins includes: an elastic portion configured to expand and contract along a first line; a first contact on a second line parallel to the first line; and a second contact on the first line. The first and second contacts are directly electrically connected to each other, and supported such that at least one of the first and second contacts is reciprocally movable through an elastic force of the elastic portion. Both of the first contacts of the first and second probe pins are positioned between the first line of the first probe pin and the first line of the second probe pin when viewed on a plane comprising the first and second lines.

A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.

The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

The present invention relates to a probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member. An embodiment of the present invention provides a probe member including a first body portion and a second body portion that are stacked in a height direction based on the other end of a contact portion, wherein the probe member is used in a test socket in a state in which at least a portion of the probe member is inserted in a pipe having an internal space.

Provided is a probe card including a lower plate, an upper plate spaced apart from the lower plate, and a needle that extends vertically to penetrate the lower plate and the upper plate, wherein the needle includes a first member that extends vertically and includes a first material, and a second member horizontally connected to the first member, wherein the second member includes a second material different from the first material.

An elastic probe element, an elastic probe assembly, and a testing device are provided. The testing device includes a substrate, a guiding member, and multiple ones of the elastic probe elements. The guiding member has a plurality of through holes for the multiple ones of the elastic probe elements correspondingly passing through. The elastic probe element includes a main body, a first contact segment, and a second contact segment that are integrally formed. The main body has a plurality of needle structures, and any two adjacent needle structures have a gap arranged therebetween. The needle structures are connected to each other through a first connection part and a second connection part arranged at a first end and a second end of the elastic probe element, respectively. The first contact segment is arranged at the first end. The second contact segment is arranged at the second end.