A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.

The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

The present disclosure provides a semiconductor testing apparatus with a connected unit, which is applied to a wafer probing testing or a final testing. The semiconductor testing apparatus comprises a semiconductor testing printed circuit board, a functional module and the connected unit. First contact points are disposed on a first surface of the semiconductor testing printed circuit board, and electrically connected to the functional module. Second contact points are disposed on a second surface of the semiconductor testing printed circuit board, and electrically connected to a functional controller. The first contact points and the second contact points have independent and non-interfering working time domains. Therefore, the present disclosure can utilize the area of the semiconductor testing printed circuit board, and can independently perform functional testing of a wafer or packaged integrated circuit devices using multiple time domains, in a multi-time domain, synchronous or asynchronous manner.

A probe card structure is provided. The probe card structure includes a circuit board, an adapter board, and a probe head assembly. The adapter board is disposed on one side of the circuit board, a plurality of electrically conductive pillars are formed on one surface of the adapter board that faces the circuit board. A solder ball is disposed on one end of each of the plurality of electrically conductive pillars facing the circuit board, and the adapter board is coupled to the circuit board through the solder balls of the plurality of electrically conductive pillars. The probe head assembly including a plurality of probes, the probe head assembly is coupled to the adapter board, and the plurality of probes are electrically connected to the adapter board.

A pogo block includes: a conductor having a first terminal connected to a terminal of a board of an inspection part, a second terminal connected to a terminal of a probe card, and an elastically expandable and contractible connection portion connecting the first terminal and the second terminal, and configured to be expandable and contractible in a direction connecting the first terminal and the second terminal; and a housing having a first holder configured to hold the first terminal, a second holder configured to hold the second terminal, and a guider into which the elastically expandable and contractible connection portion is inserted and configured to guide movements of the first holder and the second holder in the direction connecting the first terminal and the second terminal.

A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.

Provided is a probe card including a lower plate, an upper plate spaced apart from the lower plate, and a needle that extends vertically to penetrate the lower plate and the upper plate, wherein the needle includes a first member that extends vertically and includes a first material, and a second member horizontally connected to the first member, wherein the second member includes a second material different from the first material.