An apparatus is provided that is implemented to enable multiple tests of different types, such as a direct current (DC) test and/or a radio frequency (RF) test of a semiconductor device. The apparatus includes a microelectromechanical systems (MEMS) switch block coupled between the semiconductor device and automatic testing equipment (ATE). The apparatus is configured to enable/disable a DC path or an RF path to switch between a DC test and an RF test without reconfiguring the connections between the semiconductor device and the ATE. The DC path is used to perform a DC contact test for one or more pins of the semiconductor device. The RF path is used to perform an RF test for the semiconductor device.

The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.

A safety system for a needle probe card for test machines for high-voltage and high-current testing of power semiconductor electronic devices is provided. The needle probe card has a plurality of needles adapted to be placed in contact with a device under test (DUT), each needle being configured to allow a flow of electric current. The safety system has a control unit capable of determining the electric current flowing in every single needle, and a plurality of switching devices configured to selectively interrupt the electric current flowing in the needles. At least one switching device is associated with each needle of the needle probe card. The control unit is configured to drive every single switching device to selectively interrupt the flow of electric current in a corresponding needle.

A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.

A system for communicatively connecting devices for testing to respective test pins of a test head of an automatic test equipment (ATE). The system includes a tester interface device for communicative connection to the test pins of the ATE. The tester interface device includes a first connector and a second connector. The first connector is communicatively connected by the tester interface device to a first group of the test pins and the second connector is communicatively connected by the tester interface device to a second group of the test pins. The first group and the second group can be different test pins, same test pins, or combinations of some same and some different test pins. The system may also include a first pogo pin block device and a second pogo pin block device.

A calibrated test and measurement cable for connecting one or more devices under test and a test and measurement instrument, including a first port structured to electrically connect to a first signal lane, a second port structured to electrically connect to a second signal lane, a third port structured to electrically connect to a test and measurement instrument, and a multiplexer configured to switch between electrically connecting the first port to the third port and connected the second port to the third port. The first and second signal lanes can be included on the same device under test or different devices under test. An input can receive instructions to operate the multiplexer.

A probe card according to the present invention inspects a workpiece including a plurality of pads. The probe card includes: a secondary battery of a planar shape including a planar electrode of a planar shape and disposed such that the planar electrode faces the workpiece; and an electrical connection body disposed between the workpiece and the secondary battery. The secondary battery includes a structure that a wiring can be drawn from an optional portion of the planar electrode. The electrical connection body includes a plurality of contacts protruding toward the facing pads and electrically connects a plurality of pads and the planar electrode with a plurality of contacts.

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

An example apparatus includes a connection module. The example connection module includes a connection interface and a connection matrix having a root transmission line to conduct signals to and from the connection interface. The connection matrix also includes branch transmission lines that are connectable electrically to the root transmission line to conduct the signals to and from the root transmission line. Each of the branch transmission lines is part of an electrical pathway between a device and the root transmission line. A housing encloses the connection matrix and enables access to the connection interface. The root transmission line and the branch transmission lines are each multi-conductor transmission lines that conduct the signals in transverse electromagnetic (TEM) mode.