Integrated circuit devices, systems, and circuitry are provided to perform signal tests on a device under test. One such integrated circuit device may include memory having instructions to generate a number of test streams to send to a device under test and a testbench processor. The testbench processor may generate the test streams based on the instructions using thread execution circuitry that switches context based on context identifiers corresponding to respective test streams.

A method includes identifying state holding pipeline stages in a pipeline path of a design for test (DFT) of an integrated circuit design, splitting each pattern of a plurality of patterns into a first part and a second part, reformatting the plurality of patterns to generate another plurality of patterns such that the first part and the second part of each pattern of the plurality patterns are included in different patterns of the another plurality of patterns. The length of the first part is a function of a number of the identified pipeline stages.

The present invention provides a chip test method, apparatus, device, and system. The chip test system may include: a test equipment, including n chip selection signal lines, m sets of first signal lines, and m*n sets of second signal lines; and m*n chip test sites, wherein each chip test site may be coupled to one of the n chip selection signal lines and one of the m sets of first signal lines, each of the m*n chip test sites may correspond to a unique combination of a chip selection signal line and a first signal line coupled thereto, and each chip test site may be correspondingly coupled to one of the m*n sets of second signal lines. According to an embodiment of the present invention, the limited pins of a test equipment may be used to implement individual control of multiple chips.

The present invention relates a method and apparatus for setting a test configuration. A test device for testing a device under test is identified, and the measurement interfaces of the test device are assigned to appropriate measurement points of the device under test. The configuration of the test scenario is established by generating a representation of the test device and the connections between the interface of the test device and the related measurement points.

Embodiments relate to a system, program product, and method for integrating compiler-based testing in post-silicon validation. The method includes generating a test program through a device-under-test (DUT). The method also includes generating a plurality of memory intervals and injecting the plurality of memory intervals into the test program. The method further includes injecting a plurality of compiled test snippets into the test program and executing one or more post-silicon validation tests for the DUT with the test program.

A test and measurement system includes a machine learning system, a test and measurement device including a port configured to connect the test and measurement device to a device under test (DUT), and one or more processors, configured to execute code that causes the one or more processors to: acquire a waveform from the device under test (DUT),transform the waveform into a composite waveform image, and send the composite waveform image to the machine learning system to obtain a bit error ratio (BER) value for the DUT. A method of determining a bit error ratio for a device under test (DUT), includes acquiring one or more waveforms from the DUT, transforming the one or more waveforms into a composite waveform image, and sending the composite waveform image to a machine learning system to obtain a bit error ratio (BER) value for the DUT.

A circuit comprises: a bit-flipping signal generation device comprising a storage device and configured to generate a bit-flipping signal based on bit-flipping location information, the storage device configured to store the bit-flipping location information for a first number of bits, the bit-flipping location information obtained through a fault simulation process; a pseudo random test pattern generator configured to generate test patterns based on the bit-flipping signal, the pseudo random test pattern generator comprising a register configured to be a linear finite state machine, the register comprising storage elements and bit-flipping devices, each of the bit-flipping devices coupled to one of the storage elements; and scan chains configured to receive the test patterns, wherein the bit-flipping signal causes one of the bit-flipping devices to invert a bit of the register each time a second number of test patterns is being generated by the pseudo random test pattern generator during a test.

A method includes receiving tester configuration data, test pattern data, and tester operation data; configuring a circuit for performing a designated test evaluation; generating a stimulus waveform; converting the stimulus waveform to an analog stimulus signal; transferring the analog stimulus signal to a first terminal of a MTJ DUT at reception of a trigger timing signal; generating time traces based on the trigger timing signal; generating a response signal at a second terminal of the MTJ DUT and across a termination resistor as the analog stimulus signal is transferred through the MTJ DUT; converting the response signal to a digitized response signal indicating its voltage amplitude; and performing the designated test evaluation and analysis function in the configurable circuit based on voltage amplitudes and time values of the stimulus waveform, the digitized response signal, and the timing traces.

A chip testing apparatus and system suitable for performing testing on multiple chips in a chip cluster are provided. The chip testing apparatus includes a signal interface and a test design circuit. The signal interface transmits an input signal and multiple driving signals in parallel from a test equipment to each of the chips. The test design circuit receives multiple output signals from the chips through the signal interface and serially outputs a test data to the test equipment according to the output signals.

A system comprises a memory sub-system controller mounted to a printed circuit board (PCB) and an in-circuit test (ICT) device. The memory sub-system controller has test points on the PCB comprising stimulus points and observation points. The ICT device connects to the test points of the controller. The ICT device converts automated test pattern generation (ATPG) input test vectors to test signals. A first set of pin drivers of the ICT device applies the test signals to the stimulus points of the controller and a second set of pin drivers of the ICT device read output signals output at the observation points of the controller. A comparator of the ICT device compares the output signals with output test vectors. The comparator provides test result data comprising a result of the comparison.