A test board configured to test a device under test includes: a connection region including first and second connection terminals for contacting the device under test; and a first surface mount device located adjacent to the connection region, wherein the first connection terminal is configured to be electrically connected to a first voltage regulator of the device under test, wherein the second connection terminal is configured to be electrically connected to a second voltage regulator of the device under test, and wherein the first surface mount device is configured to be electrically connected to each of the first and second connection terminals.

A logic gate system for fault insertion testing can include a logic gate module having a plurality of input pins. The plurality of input pins can include an input signal pin configured to receive an input signal, a power supply input pin configured to receive power from a power supply, and a test input pin. The logic gate module can also include an output pin connected to the input pins via one or more logic gates. The logic gate system can include a power supply line connected to the power supply input pin and the test input pin. The logic gate system can also include a zero-ohm jumper resistor disposed between the power supply input pin and the test input pin. The zero-ohm resistor can be configured to be replaced with a low ohm resistor to allow reverse driving a voltage on the test input pin. The one or more logic gates can be configured to reverse an output at the output pin when the voltage on the test input pin is reverse driven.

A system includes a first integrated circuit including a first interface circuit with a first transmit pin and a first receive pin, and a first test circuit. The system also includes a second integrated circuit including a second interface circuit with a second receive pin coupled to the first transmit pin, and a second transmit pin coupled to the first receive pin. The second integrated circuit further includes a second test circuit configured to route signals from the second receive pin to the second transmit pin, such that the sent test signal is received by the second receive pin, bypasses the second test circuit, and is routed to the second transmit pin. The first test circuit is further configured to receive the routed test signal on the first receive pin via the second conductive path.

An extended joint test action group based controller and a method of use allows easier testing of integrated circuits by reducing the power dissipation of an IC. The extended joint test action group (JTAG) controller tests internal storage elements that form digital units in an integrated circuit (IC) use a design for testing scan infrastructure on the IC, wherein the JTAG controller is extended by an overall reset generator for all digital units of the IC, and a finite state machine controls the overall reset generator. In reset mode the JTAG controller stops the at least one clock module in supplying the digital units that should be reset. It then sets all scan chains in test mode and switches the input multiplexers into reset mode; and then controls the number of shift clock cycles for shifting in the reset value to the flip-flops in the scan chain, respectively.

A system includes a first integrated circuit including a first interface circuit with a first transmit pin and a first receive pin, and a first test circuit. The system also includes a second integrated circuit including a second interface circuit with a second receive pin coupled to the first transmit pin, and a second transmit pin coupled to the first receive pin. The second integrated circuit further includes a second test circuit configured to route signals from the second receive pin to the second transmit pin, such that the sent test signal is received by the second receive pin, bypasses the second test circuit, and is routed to the second transmit pin. The first test circuit is further configured to receive the routed test signal on the first receive pin via the second conductive path.

A method for detecting error on an input/output (IO) pin of an integrated circuit includes using the input/output pin of the integrated circuit in a first mode by receiving or sending a first value as analog data or digital data. The input/output pin is toggled in a test mode after each instance of using the input/output pin in the first mode. The test mode includes providing a second value disparate from the first value during a set time after using the input/output pin in the first mode, receiving back during the set time a resulting value based on providing the second value, measuring the resulting value, and identifying an error on the input/output pin of the integrated circuit based on the measured resulting value.

A test and measurement system includes a clock recovery circuit configured to receive a signal from a device under test and to produce a pattern trigger signal, a flash array digitizer having an array of counters having rows and columns configured to store a waveform image representing the signal received from the device under test, a row selection circuit configured to select a row in the array of counters, and a ring counter circuit configured to receive a clock signal, select a column in the array of counters, produce end of row signals, and produce a fill complete signal upon all of the columns having been swept, the fill complete signal indicating completion of the waveform image, an equivalent time sweep logic circuit configured to receive the pattern trigger signal and the end of row signals from the ring counter and to produce the clock signal with a delay to increment a clock delay to the ring counter until the fill complete signal is received, and a machine learning system configured to receive the waveform image and provide operating parameters for the device under test. A test and measurement system includes a flash array digitizer having an array of counters having rows and columns configured to store a waveform image representing a signal received from a device under test, a row selection circuit configured to select a row in the array of counters, a column selection circuit configured to select a column in the array of counters, a sample clock connected to the row selection circuit and the column selection circuit, and a machine learning system configured to receive the waveform image from the flash array digitizer and provide operating parameters for the device under test.

In a measurement system, a signal probing circuit may provide probed signals by probing voltages and currents and/or incident and reflected waves at a port of a device under test (DUT). A multi-channel receiver structure may include receivers that receive two probed signals from the signal probing hardware circuit, each receiver having its own sample clock derived from a master clock and further having a respective digitizer for digitizing a corresponding one of the two probed signals. A synchronization block, external to the receivers and including a reference clock derived from the master clock, may enable the two probed signals to be phase coherently digitized across the receivers by synchronizing the respective sample clocks of the receivers while the reference clock is being shared with the receivers. A signal processing circuit may then process the phase coherently digitized probed signals.

The present disclosure provides a method of testing a single device under test (DUT) through multiple cores in parallel, which includes steps as follows. The test quantity of the DUT is calculated; the test quantity of the DUT is evenly allocated to to a plurality of test cores, so as to control a period of testing the DUT through the test cores in parallel.

In some examples, a circuit includes a custom control data register (CCDR) circuit having a scan path. The CCDR circuit includes a shift register and an update register. The shift register is configured to receive scan data from a scan data input (CDR_SCAN_IN) on a first clock edge responsive to a scan enable signal (CDR_SCAN_EN) being enabled. The update register is configured to receive data from the shift register on a second clock edge after the first clock edge when the scan enable (CDR_SCAN_EN) is enabled. The update register data is asserted as a scan data output (CDR_SCAN_OUT). The second scan path includes the scan data input, the shift register, the update register, and the scan data output.