The present invention relates inter alia to a color display comprising nanoparticles and color filters.

A high-power electro-optic modulator (EOM) is formed to use specialized electrodes of a material selected to have a CTE that matches the CTE of the modulator's crystal. Providing CTE matching reduces the presence of stress-induced birefringence, which is known to cause unwanted modulation of the propagating optical signal. The specialized electrodes are preferably formed of a CuW metal matrix composite having a W/Cu ratio selected to create the matching CTE value. Advantageously, the CuW-based electrodes also exhibit a thermal conductivity about an order of magnitude greater than conventional electrode material (brass, Kovar) and thus provide additional thermal stability to the EOM's performance.

A laminate (22) is formed on a semiconductor substrate (10). Two or more grooves (54) are formed in the laminate (22). A mesa (24) with two grooves among the two or more grooves (54) positioned on both sides is formed. An insulating resin film (30) is embedded into the two or more grooves (54). A first opening (32) is formed at the insulating resin film (30) embedded in one of the two or more grooves (54) and an electrode (46) extracted upward from a bottom surface (36) is formed. A first side surface (34) of the insulating resin film (30) is inclined in a forward tapered direction.

According to one embodiment, a display device includes a first substrate and a second substrate. The first substrate includes a first switching element, a second switching element, a first organic insulating layer, a second organic insulating layer, a third organic insulating layer, a first connection electrode electrically connected to the first switching element, a second connection electrode electrically connected to the first connection electrode, a pixel electrode electrically connected to the second connection electrode, and a photoelectric conversion element electrically connected to the second switching element.

A semiconductor device comprising a wafer with a preferably single-piece semiconductor substrate, in particular silicon substrate, and at least one integrated electronic component extending in and/or on the semiconductor substrate, the wafer having a front-end-of-line and a back-end-of-line lying there above, the front-end-of-line comprising the integrated electronic component or at least one of the integrated electronic components, and a photonic platform fabricated on the side of the wafer facing away from the front-end-of-line, which photonic platform comprises at least one waveguide and at least one electro-optical device, in particular at least one photodetector and/or at least one electro-optical modulator, wherein the electro-optical device or at least one of the electro-optical devices of the photonic platform is connected to the integrated electronic component or at least one of the integrated electronic components of the wafer.

A high-power electro-optic modulator (EOM) is formed to use specialized electrodes of a material selected to have a CTE that matches the CTE of the modulator's crystal. Providing CTE matching reduces the presence of stress-induced birefringence, which is known to cause unwanted modulation of the propagating optical signal. The specialized electrodes are preferably formed of a CuW metal matrix composite having a W/Cu ratio selected to create the matching CTE value. Advantageously, the CuW-based electrodes also exhibit a thermal conductivity about an order of magnitude greater than conventional electrode material (brass, Kovar) and thus provide additional thermal stability to the EOM's performance.

A method for on-silicon integration of a III-V-based material component includes providing a first substrate having a silicon-based optical layer including a waveguide, transferring a second substrate of III-V-based material on the optical layer, and forming the III-V component from the second substrate, so as to enable a coupling between the waveguide and the III-V component, by preserving a III-V-based material layer extending laterally. The method also includes forming by epitaxy from the III-V layer, an InP:Fe-based structure laterally bordering the III-V component, forming a layer including contacts configured to contact the III-V component, and transferring a third silicon-based substrate onto the layer including the contacts.

A dot matrix light-emitting diode (LED) backlighting light source for a wafer-level microdisplay includes a substrate and a bonding layer, multiple LEDs arranged at intervals, a first electrode assembly, and a second electrode assembly sequentially formed on a top surface of the substrate. The first electrode assembly and the second electrode assembly are connected in series to the multiple LEDs to constitute a dot matrix LED light source, which allows to be directly packaged and assembled in a microdisplay in production and is advantageous in reduced size and lower production.

Efficient harmonic light generation can be achieved with ultrathin films by coupling an incident pump wave to an epsilon-near-zero (ENZ) mode of the thin film. As an example, efficient third harmonic generation from an indium tin oxide nanofilm (λ/42 thick) on a glass substrate for a pump wavelength of 1.4 μm was demonstrated. A conversion efficiency of 3.3×10.sup.−6 was achieved by exploiting the field enhancement properties of the ENZ mode with an enhancement factor of 200. This nanoscale frequency conversion method is applicable to other plasmonic materials and reststrahlen materials in proximity of the longitudinal optical phonon frequencies.

A light modulating device for modulating incident light in a given wavelength band is provided. The light modulating device may include: a first semiconductor layer; an active layer provided on the first semiconductor layer and having a multiple quantum well structure and a refractive index that is variable according to an electric field applied thereto, and a second semiconductor layer provided on the active layer and including a grating pattern in which a plurality of gratings extending in a first direction are repeatedly arranged in a second direction perpendicular to the first direction. The light modulating device may have high modulation efficiency owing to guided mode resonance by the grating pattern.