Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a substrate, at least two gate structures disposed over the substrate, each of the at least two gate structures including a gate electrode and a spacer disposed along sidewalls of the gate electrode, wherein the spacer includes a refill portion and a bottom portion, the refill portion of the spacer has a funnel shape such that a top surface of the refill portion of the spacer is larger than a bottom surface of the refill portion of the spacer, and a source/drain contact disposed over the substrate and between the spacers of the at least two gate structures.

A multi-stack semiconductor device includes: a lower-stack transistor structure including a lower active region and a lower gate structure, the lower active region including a lower channel structure, and the lower gate structure surrounding the lower channel structure; an upper-stack transistor structure vertically stacked above the lower-stack transistor structure, and including an upper active region and an upper gate structure, the upper active region including an upper channel structure, and the upper gate structure surrounding the upper channel structure; and at least one gate contact plug contacting a top surface of the lower gate structure, wherein the lower gate structure and the upper gate structure have a substantially same size in a plan view, and wherein the lower gate structure is not entirely overlapped by the upper gate structure in a vertical direction.

A semiconductor structure includes a fin extending from a substrate and oriented lengthwise in a first direction, where the fin includes a stack of semiconductor layers, an isolation feature disposed over the substrate and oriented lengthwise in a second direction perpendicular to the first direction, where the isolation feature is disposed adjacent to the fin, and a metal gate structure having a top portion disposed over the stack of semiconductor layers and a bottom portion interleaved with the stack of semiconductor layers. Furthermore, a sidewall of the bottom portion of the metal gate structure is defined by a sidewall of the isolation feature, and the top portion of the metal gate structure laterally extends over a top surface of the isolation feature.

A method of manufacturing a semiconductor structure and a semiconductor structure are disclosed. The method of manufacturing a semiconductor structure includes: providing a substrate; forming multiple support structures on the substrate, where the multiple support structures are arranged at intervals along a first direction, and a gate trench is formed between every two adjacent support structures; forming a gate structure in the gate trench; and removing a part of each of the support structures, such that each of retained support structures forms two isolation sidewalls spaced apart, the two isolation sidewalls are arranged on opposite sidewalls of the adjacent gate structures respectively, and a filling region is formed by the two isolation sidewalls.

Integrated circuit devices and methods of forming the same are provided. Integrated circuit devices may include a first channel layer including a first surface, a second channel layer that is spaced apart from the first channel layer in a first direction and includes a second surface, a first gate electrode and a second gate electrode. The first surface and the second surface may be spaced apart from each other in the first direction and may face opposite directions. The first channel layer may be in the first gate electrode, and the first gate electrode may be absent from the first surface of the first channel layer. The second channel layer may be in the second gate electrode, and the second gate electrode may be absent from the second surface of the second channel layer.

An integrated circuit includes a substrate, an interconnection part, and an isolating region located between the substrate and the interconnection part. A decoy structure is located within the isolating region and includes a silicided sector which is electrically isolated from the substrate.

A method is disclosed, including the following operations: arranging a first gate structure extending continuously above a first active region and a second active region of a substrate; arranging a first separation spacer disposed on the first gate structure to isolate an electronic signal transmitted through a first gate via and a second gate via that are disposed on the first gate structure, in which the first gate via and the second gate via are arranged above the first active region and the second active region respectively; and arranging a first local interconnect between the first active region and the second active region, in which the first local interconnect is electrically coupled to a first contact disposed on the first active region and a second contact disposed on the second active region.

A method comprises forming a gate structure between gate spacers; etching back the gate structure to fall below top ends of the gate spacers; forming a gate dielectric cap over the etched back gate structure; performing an ion implantation process to form a doped region in the gate dielectric cap; depositing a contact etch stop layer over the gate dielectric cap and an ILD layer over the contact etch stop layer; performing a first etching process to form a gate contact opening extending through the ILD layer and terminating prior to reaching the doped region of the gate dielectric cap; performing a second etching process to deepen the gate contact opening, wherein the second etching process etches the doped region of the gate dielectric cap at a slower etch rate than etching the contact etch stop layer; and forming a gate contact in the deepened gate contact opening.

Semiconductor device is provided. The semiconductor device includes a base substrate including a first region, a second region, and a third region arranged along a first direction, a first doped layer in the base substrate at the first region and a second doped layer in the base substrate at the third region, a first gate structure on the base substrate at the second region, a first dielectric layer on the base substrate coving the first doped layer, the second doped layer, and sidewalls of the first gate structure, first trenches in the first dielectric layer at the first region and the third region respectively, a first conductive layer in the first trenches, a second conductive layer on a surface of the first conductive layer at the second sub-regions after forming the first conductive layer, and a third conductive layer on the contact region of the first gate structure.

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of conductive interconnect lines in and spaced apart by a first ILD layer, wherein individual ones of the first plurality of conductive interconnect lines comprise a first conductive barrier material along sidewalls and a bottom of a first conductive fill material. A second plurality of conductive interconnect lines is in and spaced apart by a second ILD layer above the first ILD layer, wherein individual ones of the second plurality of conductive interconnect lines comprise a second conductive barrier material along sidewalls and a bottom of a second conductive fill material, wherein the second conductive fill material is different in composition from the first conductive fill material.