Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/10
Bump connectors; Manufacturing methods related thereto
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H01L2224/15
Structure, shape, material or disposition of the bump connectors after the connecting process
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H01L2224/16
of an individual bump connector
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H01L2224/16151
the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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H01L2224/16221
the body and the item being stacked
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H01L2224/16253
the bump connector connecting to a potential ring of the item
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H01L2224/16253

Lead frame structure for light emitting diode
09852967 · 2017-12-26 · ·

A lead frame structure of a light emitting diode includes a ceramic bed, a metal layer and a plastic seat. The metal layer has a first metal circuit area, a second metal circuit area, a gap dividing the first metal circuit area and the second metal circuit area, and a metal ring surrounding the first metal circuit area, the second metal circuit area and the gap. The plastic seat has a hollow function area. The first metal circuit area, the second metal circuit area and a part of the metal ring expose the function area to make the metal (circuit) layer of the function area has no gap to avoid excess glue. This can efficiently accomplish to increase intensity, quality and reliability of the packaged products.