An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive pad having a generally planar top surface that includes a cavity having a bottom surface and sidewalls extending from the bottom surface of the cavity to the top surface of the pad. An electronic device is attached to the top surface of the electrically conductive pad. A wire bond is attached from the electronic device to the bottom surface of the cavity. A molding compound encapsulates the electronic device.

A semiconductor package includes: a first substrate having a first metallized side; a semiconductor die attached to the first metallized side of the first substrate at a first side of the die, a second side of the die opposite the first side being covered by a passivation, the passivation having a first opening that exposes at least part of a first pad at the second side of the die; a thermally and electrically conductive spacer attached to the part of the first pad that is exposed by the first opening in the passivation, the spacer at least partly overhanging the passivation along at least one side face of the semiconductor die; a second substrate having a first metallized side attached to the spacer at an opposite side of the spacer as the semiconductor die; and an encapsulant encapsulating the semiconductor die and the spacer. Additional spacer embodiments are described.

Example embodiments relate to lead frame based molded radio frequency packages. One example package includes a substrate. The package also includes a first electrical component arranged on the substrate. Additionally, the package includes a second electrical component. Further, the package includes a plurality of leads that are arranged spaced apart from the substrate and fixed in position relative thereto by a solidified molding compound. The leads were part of a lead frame prior to separating the package from the lead frame. The substrate was physically and electrically connected to the lead frame using a plurality of spaced apart connecting members prior to separating the package from the lead frame. During the separating of the package from the lead frame, each connecting member was divided into a first connecting member part and a second connecting member part. In addition, the package includes a frame part.

There is provided a semiconductor module capable of preventing the peeling of a sealing resin on the side where connection sections used for the connection to semiconductor elements are arranged. A semiconductor module includes: an outer frame; sealing resins; gate signal output terminals, and partition sections laid across the outer flame to partition a space into a plurality of housing sections, in the partition sections which the gate signal output terminals with connection sections exposed are arranged. The partition sections have first surface sections on the side where the connection sections are arranged and second surface sections formed, on the side where the connection sections are not arranged, such that the peeling strength to the sealing resins is lower than that of the first surface sections.

An electronic device includes a package structure, a first lead and a second lead. The first lead has a first portion extending outward from a side of the package structure and downward, and a second portion extending outward from the first portion away from the package side. The second lead has a first portion extending outward from the package side and downward, and a second portion extending inward from the first portion toward the package side, and a distal end of the second lead is spaced from the package side.

A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe assembly. The package leadframe includes a plurality of leads. An adhesive is placed on a portion of the plurality of leads. A die pad is placed onto the adhesive. A portion of the die pad overlaps the portion of the plurality of leads. A semiconductor die is attached to the die pad. A molding compound encapsulates the semiconductor die and a portion of the package leadframe assembly.

In a described example, an apparatus includes a transformer including: an isolation dielectric layer with a first surface and a second surface opposite the first surface; a first inductor formed over the first surface, the first inductor comprising a first layer of ferrite material, and a first coil at least partially covered by the first layer of ferrite material; and a second inductor formed over the second surface, the second inductor comprising a second layer of ferrite material and a second coil at least partially covered by the second layer of ferrite material.

A semiconductor package device having a porous copper adhesion promoter layer is provided. The porous copper adhesion promoter layer developed via de-metallization of the intermetallic compound layer grown after the thermal treatment of a thin metal layer plated on the copper base material. The highly selective de-metallization of the intermetallic compound layer ensures that the plated surfaces are not affected and does not create wire-bondability issues. The porous copper layer solves the delamination between the carrier and the epoxy molding compound by providing mechanical interlock features. Further, increasing the surface area of contact between the carrier and the epoxy molding compound improves the mechanical interlock features.

A semiconductor apparatus includes a semiconductor element, a control terminal electrically connected to a top electrode of the semiconductor element through a wiring member, and a case member in which at least a portion of the control terminal is embedded and which defines a space for housing the semiconductor element. The control terminal includes a pad to which the wiring member is connected. The case member includes a wiring member positioning part raised on the case member as a reference point for a positioning of the wiring member before a connection is made of the wiring member to the pad.

A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).