An electrical capacitor includes a dielectric spacer. Metal electrodes are held in contact with opposite surfaces of the dielectric spacer by magnetic force.

A dielectric composition includes one of BaTiO.sub.3, (Ba,Ca) (Ti,Ca)O.sub.3, (Ba,Ca) (Ti,Zr)O.sub.3, Ba(Ti,Zr)O.sub.3 and (Ba,Ca) (Ti,Sn)O.sub.3, as a main component, a first subcomponent including a rare earth element, and a second subcomponent including at least one of a variable valence acceptor element and a fixed valence acceptor element. When a sum of contents of the rare earth element is defined as DT and a sum of contents of the variable valence acceptor element and the fixed valence acceptor element is defined as AT, (DT/AT)/(Ba+Ca) satisfies more than 0.5 and less than 6.0. In addition, a multilayer electronic component including the dielectric composition is provided.

The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.

A sandwich-structured dielectric material for pulse energy storage is provided as well as a preparation method thereof. Employing a sandwich structure and combining the properties of ceramic-glass materials prepares a high performance dielectric material for pulse energy storage, in which the ceramic dielectric is core-shell structured powder of Ba.sub.xSr.sub.1-xTiO.sub.3 coated with SiO.sub.2, and the glass material is alkali-free glass AF45, of which the chemical composition is 63% SiO.sub.2-12% BaO-16% B.sub.2O.sub.3-9% Al.sub.2O.sub.3. AF45 alkali-free glass paste is spin-coated on both sides of the ceramic and calcined to get a layer-structured material of glass-ceramic-glass.

A power storage device, containing two electrodes, and a plate-like crystal structure smectite-based clay film between the electrodes.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Provided is the dielectric response of atomic layer-deposited and annealed polymorphic BaTiO.sub.3 and BaTiO.sub.3—Al.sub.2O.sub.3 bi-layer thin films based on nanocry stalline BaTiO.sub.3 containing the perovskite and hexagonal polymorphs. Also provided are BaTiO.sub.3 films having tuned Curie temperatures. Further provided are capacitive components, comprising: a plurality of films, the plurality of films comprising: a first grained film component, the first grained film component comprising at least one of SrTiO.sub.3, BaTiO.sub.3, and (Ba, Sr)TiO.sub.3, and the first grained film component being characterized as being at least partially polymorphic crystalline in nature; a second film component contacting the first grained film component, the second film component optionally comprising Al.sub.2O.sub.3, and the first grained film component optionally defining an average grain size of less than about 10 micrometers.

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of first and second internal electrodes disposed on the dielectric layers to face each other with each of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer includes a dielectric ceramic composition including a base material main component represented by z(Ba.sub.(1-x)Ca.sub.xTiO.sub.3-(1-z)BaTi.sub.2O.sub.5 including a first main component represented by (Ba.sub.(1-x)Ca.sub.x)TiO.sub.3 and a second main component represented by BaTi.sub.2O.sub.5, 0.7≤z≤0.8 and 0≤x<0.1.

A glass ceramic that contains a glass containing Si, B, Al, and Zn and aggregates. The glass has a SiO.sub.2 content of 20% by weight to 55% by weight, a B.sub.2O.sub.3 content of 15% by weight to 30% by weight, Al.sub.2O.sub.3, and ZnO, wherein a weight ratio of the SiO.sub.2 to the B.sub.2O.sub.3 (SiO.sub.2/B.sub.2O.sub.3) is 1.21 or higher, and a weight ratio of the Al.sub.2O.sub.3 to the ZnO (Al.sub.2O.sub.3/ZnO) is 0.8 to 1.3. A TiO.sub.2 content, a ZrO.sub.2 content, a SnO.sub.2 content, and a Sr0 content in the glass each are 0% by weight to 5% by weight. The aggregates include 20% by weight to 50% by weight of SiO.sub.2, 1% by weight to 10% by weight of TiO.sub.2, 3% by weight or less of ZrO.sub.2, and 1% by weight or less of ZnO each relative to the weight of the glass ceramic.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.