A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and at least a pair of external electrodes that are provided on the first face and the second face of the ceramic multilayer structure, wherein the external electrode includes a base conductive layer including ceramic of 5 weight % or less and being mainly composed of a transition metal other than an iron group or a noble metal and a first plated film having a thickness that is half of a thickness of the base conductive layer or more and being mainly composed of a transition metal other than an iron group.

A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein the external electrode includes a base conductive layer that includes glass of less than 7 weight % and is mainly composed of a transition metal other than an iron group or a noble metal, and a first plated film that covers the base conductive layer, has a thickness that is half of a thickness of the base conductive layer or more and is mainly composed of a transition metal other than an iron group.

A multilayer ceramic capacitor includes: a ceramic multilayer structure in which a ceramic dielectric layer and an internal electrode layer mainly composed of transition metal other than iron-group transition metal are alternately stacked, and a plurality of the internal electrode layers stacked are alternately exposed to a pair of end surfaces of the ceramic multilayer structure; a pair of external electrodes that are coupled to the internal electrode layer in the pair of end surfaces and are mainly composed of transition metal other than iron-group transition metal; and a conductor that is fixed to the ceramic multilayer structure, is located in a region other than a region in which the plurality of the internal electrode layers face each other, and is mainly composed of iron-group transition metal.

A plurality of dielectric layers containing one of CaZrO.sub.3 and SrZrO.sub.3 and a plurality of internal electrodes containing Ni are alternately disposed in a second direction. The plurality of internal electrodes includes a plurality of first internal electrodes and a plurality of second internal electrodes. Each of first connecting portions of the first internal electrodes includes a first end portion connected to a first terminal electrode. Each of second connecting portions of the second internal electrodes includes a second end portion connected to a second terminal electrode. The first end portions of the first connecting portions adjacent to each other in the second direction are located not to overlap with each other when viewed from the second direction. The second end portions of the second connecting portions adjacent to each other in the second direction are located not to overlap with each other when viewed from the second direction.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers which are stacked and internal electrode layers which are stacked, and external electrodes, each connected to the internal electrode layers. The external electrodes each include a conductive resin layer and a plated layer on the conductive resin layer. The conductive resin layer includes a resin portion, conductive fillers dispersed in the resin portion, and metal particles dispersed unevenly in a distribution differing from that of the conductive fillers in the conductive resin layer. An abundance ratio of the metal particles to the resin portion is higher on a side of the plated layer of the conductive resin layer than on a side of the conductive resin layer close to the multilayer body.

A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic; and a pair of external electrodes that are formed on the two end faces; wherein: the pair of external electrodes have a structure in which a plated layer is formed on a ground layer; a main component of the ground layer is a metal or an alloy including at least one of Ni and Cu; and at least a part of a surface of the ground layer on a side of the plated layer includes an interposing substance including Mo.

Ceramic raw material powder includes: a main phase having a perovskite structure, wherein elements acting as a donor and an acceptor are solid-solved in B sites of the perovskite structure, wherein a relationship of (concentration of the element acting as a donor)×(valence of the element acting as a donor−4)<(concentration of the element acting as an acceptor)×(4−valence of the element acting as an acceptor) is satisfied, in a center region of each grain of the ceramic raw material powder, wherein a relationship of (concentration of the element acting as a donor)×(valence of the element acting as a donor−4)>(concentration of the element acting as an acceptor)×(4−valence of the element acting as an acceptor) is satisfied, in a circumference region of each grain of the ceramic raw material powder.

A multilayer ceramic capacitor includes a ceramic main body including dielectric layers and internal electrodes, principal surfaces, side surfaces, and end surfaces, and an external electrode electrically connected to the internal electrode on both end surfaces. The dielectric layer includes at least one element of Si and Mg. In a section defined by the width and lamination directions at a position of a central portion in the length direction of the ceramic main body, an outside in the width direction is higher than a central portion in the width direction in an amount of at least one element existing in a rectangular region of about 10 μm×about 10 μm of the dielectric layer in planar view, and continuity of the internal electrodes within a range of about 10 μm from an end in the width direction of the internal electrodes is greater than or equal to about 95%.

A multilayer ceramic capacitor includes a multilayer body including a plurality of dielectric layers and a plurality of internal electrodes, wherein the dielectric layers and the internal electrodes are stacked alternately; and external electrodes provided on end surfaces of the multilayer body and electrically connected to the internal electrodes, wherein the dielectric layers each include main crystal grains including calcium and/or strontium, and zirconium; and an additive component including lithium, the internal electrodes include copper, and the dielectric layers have lithium concentrations with a standard deviation of about 1.03 atomic percent or less in the thickness direction.

A multilayer ceramic capacitor includes a laminated body including dielectric layers and internal electrode layers alternately laminated in a width direction, and first and second external electrodes on a bottom surface of the laminated body. Among ridges located on a side of an upper surface of the laminated body of an inner layer generating capacitance, a ridge located on the side of a first end surface is a first ridge, and a ridge located on the side of a second end surface is a second ridge. When r1 is a curvature radius of the first ridge at a central position in the width direction of the laminated body, and r2 is a curvature radius of the second ridge at the central position in the width direction of the laminated body, conditions of r1≤50 μm and r2≤50 μm are satisfied.