A dielectric ceramic composition that contains an oxide of A, R, and B and an oxide of Mn. The A is at least one selected from the group consisting of K and Na. The R is at least one selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and Sc. The B is at least one selected from the group consisting of Nb and Ta. The molar ratio of the A:R:B:Mn is 2−x:1+x/3:5+y:z. The x, y, and z satisfy −0.3≤x≤0.6, −0.5≤y≤0.5, and 0.001≤z≤0.5, respectively.

Provided are a dielectric material including a compound represented by Formula 1, a device including the same, and a method of preparing the dielectric material:

(1−x)K.sub.aNa.sub.bNbO.sub.3.xM(A.sub.cSb.sub.d)O.sub.3  [Formula 1] wherein, in Formula 1, M is a Group 2 element, A is a trivalent element, and 0<x<1, 0<a<1, 0<b<1, 0<c<1, 0<d<1, a+b=1, and c+d=1.

A ceramic component having a ceramic main part containing AxByC1−x−vTi1—y+wO3* (Mn2P2O7)z*Du, in which A is a first dopant selected from a group including neodymium, praseodymium, cerium, and lanthanum, B is a second dopant selected from a group including niobium, tantalum, and vanadium, C is selected from a group including calcium, strontium, and barium, and D includes a metal selected from a group including aluminum, nickel, and iron. x is the proportion of A, y is the proportion of B, v is the proportion of A vacancies, w is the proportion of excess titanium, z is the proportion of Mn2P2O7, u is the proportion of D, and the following applies: 0.0≤x≤0.1, 0.0≤y<0.1, 0≤v<1.5*x, 0≤w<0.05, 0.01≤z<0.1, 0≤u<0.05. A method for producing the ceramic component is also disclosed.

A capacitor may comprise a substrate and a first electrically conductive electrode layer. A metal oxide layer may be deposited on at least one of the substrate or the first electrically conductive electrode layer. A proximal region of the metal oxide may comprise a stoichiometric, dielectric, oxygen vacancy-free portion of the metal oxide. The proximal region may be in communication with the first electrically conductive electrode layer. A distal region of the metal oxide may comprise a constant oxygen vacancy portion. The distal region may be in communication with a second electrically conductive electrode layer. The metal oxide may comprise a gradient region comprising a substantially stoichiometric metal oxide portion and a substantially constant oxygen vacancy portion. The gradient region may comprise an increasing oxygen vacancy gradient from the proximal region to the distal region. The second electrically conductive electrode layer may be deposited on the distal region.

To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.

To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member separating the first and second electrode layers. The insulating member has a tapered shape in cross section. With the above configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the insulating member has a tapered shape in cross section, adhesion performance of the insulating member can be enhanced, thus making it possible to prevent short-circuit between the first and second electrode layers.

To provide a thin film capacitor in which warpage is less likely to occur. A thin film capacitor includes: a metal foil having roughened upper and lower surfaces; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a dielectric film covering the lower surface of the metal foil and made of a dielectric material having a thermal expansion coefficient smaller than that of the metal foil; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the first dielectric film without contacting the metal foil. The lower surface of the metal foil is thus covered with the dielectric film having a small thermal expansion coefficient, thereby making it possible to prevent the occurrence of warpage.

To provide a thin film capacitor having high adhesion performance with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The first and second electrode layers are formed in an area surrounded by an outer peripheral area of the upper surface of the metal foil so as not to cover the outer peripheral area. The outer peripheral area of the roughened upper surface of the metal foil is thus exposed, so that adhesion performance with respect to a circuit substrate can be enhanced.

To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same plane. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the metal foil is surface-roughened, a larger capacitance can be obtained.