H01G4/1227

Multilayer ceramic electronic component
11569038 · 2023-01-31 · ·

A multilayer ceramic electronic component includes first and second multilayer ceramic electronic component bodies facing each other in a length direction that connects first and second end surfaces. A first metal terminal is connected to a first outer electrode. A second metal terminal is connected to a fourth outer electrode. An outer casing covers the first and second multilayer ceramic electronic component bodies, and at least a portion of each of the first and second metal terminals. A third metal terminal is exposed from the outer casing.

Ceramic electronic component and method of manufacturing the same

A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.

Ceramic electronic device
11569035 · 2023-01-31 · ·

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. A relationship of “I.sub.A/I.sub.B>0.30” is satisfied and a peak current value I.sub.B is 100 pA/mm.sup.2 or less in a TSDC in which a polarizing temperature is 150 degrees C., a polarizing electric field is 15 V/μm to 20 V/μm, a polarizing time is 60 minutes, and an increasing speed of temperature is 10° C./minute, when a peak current of a low temperature side of a temperature range of 160 degrees C. or more and less than 230 degrees C. is I.sub.A and a peak current of a high temperature side of a temperature range of 230 degrees C. or more and 350 degrees C. or less is I.sub.B.

THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR

A three-terminal multilayer ceramic capacitor includes at least one surface electrode layer on a surface of a second internal electrode layer connected to a lateral surface external electrode. The surface electrode layer includes at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y or Cu, which is different from a main component of the second internal electrode layer.

AMORPHOUS DIELECTRIC, CAPACITOR ELEMENT, AND ELECTRONIC DEVICE

An amorphous dielectric includes a compound represented by A.sub.1+αBO.sub.xN.sub.y. −0.3≤α≤0.3, 0<x≤3.50, 0≤y≤1.00, and 6.70≤2x+3y≤7.30 are satisfied. A sum of an average valence of A-site ions and an average valence of B-site ions is 6.70 to 7.30.

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR
20230231004 · 2023-07-20 · ·

Provided are a capacitor and a semiconductor device including the same. The capacitor includes: a dielectric layer having a perovskite crystal structure; and first and second electrodes spaced apart from each other with the dielectric layer therebetween. At least one of the first and second electrodes includes a metallic layer having a perovskite crystal structure, a first ionic layer having ionic properties, and a semiconductor layer.

CERAMIC ELECTRONIC COMPONENT

A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, in which the dielectric layers include a plurality of dielectric crystal grains, an average number of dielectric crystal grains per unit thickness (1 μm) of the dielectric layers is 6 or more, and td is 2.0 μm or less, td being an average thickness of at least one of the dielectric layers.

MULTILAYER ELECTRONIC COMPONENT

A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO.sub.3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.

MULTILAYER CERAMIC CAPACITOR
20230230773 · 2023-07-20 ·

A multilayer ceramic capacitor includes a multilayer body including dielectric layers laminated on each other, inner electrode layers laminated on the dielectric layers, first and second main surfaces, first and second end surfaces, and first and second lateral surfaces, first and second external electrodes on the first and second end surfaces, an inner layer portion in which the inner electrode layers are opposed to each other, outer layer portions on first and second main surface sides and first and second lateral surface sides. Voids are provided in the outer layer portions on the first and second lateral surface sides. A ratio of a total area of the voids relative to an area of the outer layer portion on the first or second lateral surface side in a cross section of the multilayer body is greater than or equal to about 0.02% and less than or equal to about 0.2%.

MULTILAYER CERAMIC CAPACITOR
20230230774 · 2023-07-20 ·

A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. The dielectric layers include outer layer portions and an effective layer portion. Each outer layer portion is adjacent to a corresponding main surface of the stacked body. Each outer layer portion is a dielectric layer located between a corresponding main surface and an internal electrode closest to the main surface. A ratio of a dimension of the effective layer portion in a stacking direction to a dimension of the stacked body in the stacking direction is not less than about 53% and not more than about 83%.