A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.

A dielectric ceramic composition including a first component and a second component. The first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %. The second component includes (by mass) at least (a) an oxide of Mn of 0.005% to 3.500% and (b) one or both of an oxide of Cu of 0.080% to 20.000% and an oxide of Ru of 0.300% to 45.000%.

A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.

A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld≤Lm.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

A multilayer capacitor includes a body including dielectric layers and internal electrodes, and external electrodes, wherein the body has first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction perpendicular to the first and second directions. A length of a portion of the plurality of internal electrodes in the third direction in an intermediate region of the body in the first direction is greater than a length of the first surface or the second surface of the body in the third direction. The plurality of internal electrodes have a bottleneck structure between the intermediate region and at least one of the first and second surfaces, and wherein the bottleneck structure has a shape recessed into an inner portion of the body.

A capacitor body includes a plurality of dielectric layers and a plurality of internal electrode layers stacked alternately. The plurality of dielectric layers include crystal grains of barium titanate, a rare earth element, and silicon. The crystal grains include a first crystal grain and a second crystal grain. The crystal grains each include a surface layer as a shell and an interior portion surrounded by the shell as a core. The first crystal grain has a higher concentration distribution of the rare earth element in the shell than in the core. The second crystal grain has distribution in which a ratio of a concentration of the silicon in the core and the shell is lower than a ratio of a concentration of the rare earth element in the core and the shell in the first crystal grain.

A pre-press process includes a first step for bonding a first end portion of each of a plurality of electronic component bodies to a bonding surface of a flat plate material disposed in a jig, a second step for moving the jig relative to a surface plate, a third step for bringing a second end portions of each of the plurality of electronic component bodies into contact with the surface plate while the flat plate material is in a softened state so that the flat plate material is deformed to align respective positions of end surfaces of the second end portions, a fourth step for curing the flat plate material, and then a fifth step for moving the jig relative to the surface plate to separate from the surface plate the plurality of electronic component bodies in which the respective positions of the end surfaces are aligned.

A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. A region, containing nickel (Ni) and carbon (C), is present between the internal electrode layer and the dielectric layer.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately stacked on one another, and two external electrodes on two end surfaces of the multilayer body. The internal electrodes include first internal electrodes and second internal electrodes arranged alternately. A distance between the first internal electrodes adjacent to each other includes a distance T11 and a distance T12. The distance T11 is greater than the distance T12. A distance between the second internal electrodes adjacent to each other includes a distance T21 and a distance T22. The distance T21 is greater than the distance T22.