A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer to extend from a surface layer of the underlying electrode layer to an interface of the multilayer body, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other, an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other, and an interface between the metal component included in the underlying electrode layer and the multilayer body.

New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.

A label and related method of manufacture that includes a fabric made of yarn, in either cut individual singles or continuous ribbon format in any length. The yarn includes a fiber that has been recycled, that is recyclable, that is organic, that is biodegradable, and/or that can be derived from a material that is known to be environmentally friendly. The yarn, in one embodiment, may include a fiber defined as “high filament count” material, above the current industry standard of 24 filaments, being in the range of 72 to 96 to 144 filaments or higher per individual yarn, in any denier range of 30 denier to 150 denier thickness, in natural raw white, optical dyed white, or dyed colors. These yarns can be independent of each other.

A multi-layer ceramic capacitor includes a first region, a second region, a multi-layer unit, and a side margin. In the first region, crystal grains including intragranular pores are dispersed. In the second region, crystal grains including intragranular pores are not dispersed. The multi-layer unit includes ceramic layers that are laminated in a first direction and include the second region, and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction and includes a region, the region being adjacent to the multi-layer unit and including the first region.

A multi-layer ceramic electronic component includes: a ceramic body having a substantially rectangular parallelepiped shape; and external electrodes each including a base layer, a conductive resin layer, and first and second conductive layers. A conductive filler includes a core portion and a silver coating film made of silver and covering the core portion. In a cross-section parallel to the first and second axes, when a straight line parallel to the first axis is drawn to pass through a range distant from a base end portion, and when a thickness of the first conductive layer along the line is a conductor thickness, and the sum of lengths of the silver coating film along the line in all the conductive fillers on the line is a total thickness of silver coating, a ratio of the conductor thickness to the total thickness of silver coating is 2 or more and 10 or less.

In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.

A multi-layer capacitor including a capacitor element having at least two segments. Each segment includes multiple layer planes, including ceramic dielectric layers and electrode layers arranged therebetween, which are arranged in a layer sequence one above the other. The electrode layers include different electrodes, including at least first and second electrodes. The different electrodes overlap in active regions but not in passive regions. Multiple segments are arranged one above the other in a stack direction. The outermost dielectric layers of two segments form a connection region in which the segments are fixedly connected to each other parallel to the layer planes. The connection region contains a relief region. The relief region occupies at least the entire passive region of the capacitor.

A ceramic electronic component includes a multilayer structure including dielectric layers and internal electrode layers, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other. A rare earth element of a side margin has an ionic radius smaller than that of a rare earth element of a capacity section. The rare earth element of the side margin is a rare earth element when only the rare earth element is added to the side margin, or a rare earth element with a largest amount when rare earth elements are added to the side margin. The rare earth element of the capacity section is a rare earth element when only the rare earth element is added to the capacity section, or a rare earth element with a largest amount when rare earth elements are added to the capacity section.

A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

A ceramic electronic component includes a body, including a dielectric layer and an internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell, surrounding at least a portion of the core, and a second shell, surrounding at least a portion of the first shell. The dual shell includes different types of rare earth elements R1 and R2, and R2.sub.S1/R1.sub.S1 is 0.01 or less and R2.sub.S2/R1.sub.S1 is 0.5 to 3.0, where R1.sub.S1 and R1.sub.S2 denote concentrations of R1 included in the first shell and the second shell, respectively, and R2.sub.S1 and R2.sub.S2 denote concentrations of R2 included in the first shell and the second shell, respectively.